Equipment List: Difference between revisions
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'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.''' | |||
== Lithography == | == Lithography == | ||
===== Electron Beam Lithography ===== | ===== Electron Beam Lithography ===== | ||
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* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]] | * [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]] | ||
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]] | * [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]] | ||
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]] | |||
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]] | * [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]] | ||
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]] | * [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]] | ||
* [[Optical Lithography Resources]] | |||
== Deposition == | == Deposition == | ||
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* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | * [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | ||
===== Sputtering ===== | ===== Sputtering ===== | ||
* [[ATC Orion 8: Dielectric | * [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]] | ||
* [[ATC Orion 8: Chalcogenide | * [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]] | ||
===== Chemical Vapor Deposition (CVD) ===== | ===== Chemical Vapor Deposition (CVD) ===== | ||
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]] | * [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]] | ||
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===== Dry Etching ===== | ===== Dry Etching ===== | ||
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]] | * [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]] | ||
* [[ICP-RIE: III | * [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]] | ||
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]] | * [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]] | ||
* [[Dual Chamber RIE: Silicon, III | * [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | ||
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | * [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | ||
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== Microscopy == | == Microscopy == | ||
===== KNI Microscopy Policies ===== | |||
* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies] | |||
===== Guide to Choosing KNI SEMs & FIBs ===== | |||
*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]] | |||
===== Focused Ion Beam (FIB) Systems ===== | ===== Focused Ion Beam (FIB) Systems ===== | ||
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | * [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]] | ||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Scanning Electron Microscopes (SEMs) ===== | ===== Scanning Electron Microscopes (SEMs) ===== | ||
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM | * [[Nova 200 NanoLab: SEM, EDS & WDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]] | ||
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]] | * [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]] | ||
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | * [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]] | ||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | * [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Transmission Electron Microscopes (TEMs) ===== | ===== Transmission Electron Microscopes (TEMs) ===== | ||
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 ( | * [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]] | ||
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 ( | * [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]] | ||
===== Scanning Probe Microscopes ===== | ===== Scanning Probe Microscopes ===== | ||
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]] | * [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]] | ||
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== Wet Chemistry == | == Wet Chemistry == | ||
* [[Wet Chemistry | Wet Chemistry | ===== Wet Chemistry Main page===== | ||
* [[ | * [[Wet Chemistry | Wet Chemistry page:]] - Facilities, Procedures & Safety, Chemical Lists | ||
===== Wet Chemistry Safety page===== | |||
* [[Wet Chemistry Safety | Wet Chemistry Safety page]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices. | |||
===== Wet Chemistry Resources page===== | |||
* [[Wet Chemistry Resources | Wet Chemistry Resources page]] - Contains fabrication recipes and procedures. | |||
== Support Tools == | == Support Tools == | ||
===== Laboratory Data ===== | |||
* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information] | |||
===== Thermal Processing ===== | ===== Thermal Processing ===== | ||
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | * [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | ||
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===== Metrology ===== | ===== Metrology ===== | ||
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | * [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]] | ||
* [[ | * [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | ||
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | * [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]] | ||
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | * [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] | ||
===== Sample Preparation ===== | ===== Sample Preparation ===== | ||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | * [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | ||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
Revision as of 01:19, 12 October 2021
NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Nano Imprint Lithography: NILT CNI-PV 2.1
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
- Optical Lithography Resources
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputter System: AJA International ATC Orion 8
- Chalcogenide Sputter System: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
- III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
- Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
KNI Microscopy Policies
Guide to Choosing KNI SEMs & FIBs
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- SEM & EDS: Thermo Fisher Nova 200 NanoLab
- SEM & EDS: Thermo Fisher Sirion
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)
- TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometer: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Fluorescence Microscope: Olympus IX81
Sample Preparation for Microscopy
- Carbon Evaporator (Leica EM ACE600) to make samples conductive
- Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
- TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
Wet Chemistry
Wet Chemistry Main page
- Wet Chemistry page: - Facilities, Procedures & Safety, Chemical Lists
Wet Chemistry Safety page
- Wet Chemistry Safety page - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
Wet Chemistry Resources page
- Wet Chemistry Resources page - Contains fabrication recipes and procedures.
Support Tools
Laboratory Data
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
Metrology
- Spectroscopic Ellipsometer: Woolam M-2000
- Profilometer: Veeco Dektak 3ST
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Electrical Probing Station: Cascade Microtech M150