Wedge-Wedge Wire Bonder

Wire Bonder Instrument Type Support Tools, Device Processing Techniques Wire Bonding Staff Manager Nathan Lee Staff Email nathslee@caltech.edu Staff Phone 626-395-4075 Reserve time on FBS Request training via FBS User Dashboard Lab Location B233 Steele Lab Phone 626-395-5429 Manufacturer WestBond Model 7476D-79

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.

Applications

• Bonding aluminum wire to a metal bond pads.
• Aluminum wire thickness currently being used is 0.001 inch.

Resources

SOPs & Troubleshooting

• WestBond - General SOP
• WestBond - Tool Change SOP
• WestBond - Changing the wire spool-This presentation also give guidance on THREADING THE WIRE.

Manufacturer Manuals

• WestBond 7476D Wire Bonder Manual
• WestBond K1200D Temperature Controller Manual

FBS Reservation Rules:

	Advanced Res (days)	Limit per Res (hrs)	Limit per week (hrs)
Weekday	7	4	12
Weeknight	7	6	18
Weekend	14	6	18

For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.

Specifications

Manufacturer Specifications

• See - WestBond 7476D Wire Bonder Manual
• Recommended Bond Pad Requirements:

1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.

Bonding will be difficult and little room for error.

2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).

3. Minimum Pad Thickness - 150nm Gold (thicker is better).

4. Suggested Pad Thickness - 250nm Gold.