Wedge-Wedge Wire Bonder

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Wire Bonder
Wedge-Wedge-Wire-Bonder Westbond-7476D-79.jpg
Instrument Type Support Tools,
Device Processing
Techniques Wire Bonding
Staff Manager Bert Mendoza
Staff Email
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for WestBond Wire Bonder email list
Lab Location B233 Steele
Lab Phone 626-395-5429
Manufacturer WestBond
Model 7476D-79


Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.

  • Bonding aluminum wire to a metal bond pads.
  • Aluminum wire thickness currently being used is 0.001 inch.


SOPs & Troubleshooting
Manufacturer Manuals
Labrunr Reservation Rules:
Advanced Res (days) Limit per Res (hrs) Limit per week (hrs)
Weekday 7 4 12
Weeknight 7 6 18
Weekend 14 6 18

For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.


Manufacturer Specifications
1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.
Bonding will be difficult and little room for error.
2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
3. Minimum Pad Thickness - 150nm Gold (thicker is better).
4. Suggested Pad Thickness - 250nm Gold.