Wedge-Wedge Wire Bonder

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Wire Bonder
Wedge-Wedge-Wire-Bonder Westbond-7476D-79.jpg
Instrument Type Support Tools,
Device Processing
Techniques Wire Bonding
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for WestBond Wire Bonder email list
Lab Location B233 Steele
Lab Phone 626-395-5429
Manufacturer WestBond
Model 7476D-79

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.

Applications
  • Bonding aluminum wire to a metal bond pad
  • Bonding gold wire to a metal bond pad

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Manufacturer Specifications