XeF2 Silicon Etcher
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Lab Location
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B235C Steele
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Lab Phone
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626-395-1539
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Manufacturer
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N/A
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Model
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N/A
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Description
The XeF2 etcher flows pressure- and time-controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices.
Applications
- Very high selectivity dry Si etching
- MEMS fabrication
Resources
Equipment Data
SOPs