Dual Chamber RIE: Silicon, III-V Material & Organics Etcher

Dual Chamber RIE Instrument Type Etching Techniques Silicon and compound semiconductor Reactive Ion Etching Staff Manager Kelly McKenzie Staff Email kmmckenz@caltech.edu Staff Phone 626-395-5732 Reserve time on FBS Request training via FBS User Dashboard Lab Location B235 Steele Lab Phone 626-395-1532 Manufacturer Plasma-Therm Model SLR 720

Description

The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon semiconductors with a traditional RIE process.

Applications

• Silicon Etching
• Organic Material Etching

Allowed Material in RIE

• Si, Si_xN_y, SiO₂, Ge
• PMMA/ZEP/SPR/AZ/maN resists, SiO_x/Al₂O₃ hard masks
• Buried/backside metal ok if never exposed (not an etch stop)

RIE Gas List

• SF₆
• CHF₃
• CF₄
• O₂
• Ar
• He
• H₂

Resources

SOPs & Troubleshooting

• KNI SOP
• Oxfords and RIE reservation and use policy
• Etcher toxic gas handling SOP

Process Documents

• Process Standards
• Al2O3 Etch in Oxford ICP and Plasmatherm RIE

Review Articles

• Guidelines for Etching Silicon MEMS Structures
• Etch rates for MEMS Processing - Part I
• Etch Rates for MEMS Processing - Part II
• Dry Etching of Electronic Oxides, Polymers, and Semiconductors
• Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars

Manufacturer Manuals

• In progress

Specifications

Manufacturer Specifications

• In progress

System Features

• In progress

System Specifications

• In progress

Related Tools

• Oxford III-V ICP-RIE
• Oxford Dielectric ICP-RIE
• Oxford DRIE ICP-RIE
• XeF2 Etcher
• Oxford PECVD
• Oxford ALD