Wafer Bonder

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Wafer Bonder
Wafer-Bonder Suss-SB6L.jpg
Instrument Type Support Tools,
Substrate Processing
Techniques Pressure/Heat Bonding
Staff Manager Alireza Ghaffari
Staff Email alireza@caltech.edu
Staff Phone 626-395-3984
Reserve time on LabRunr
Request training by email
Lab Location B217 Steele
Lab Phone 626-395-1539
Manufacturer Suss Microtec
Model SBL6


The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.

  • MEMS & Microelectronics Fabrication


  • KNI SB6L SOP - Operating Instructions for the Suss SB6L Wafer Bonder
Manufacturer Manuals