| Scriber-Breaker
|
|
|
|
| Lab Location
|
B213 Steele
|
| Lab Phone
|
626-395-1537
|
| Manufacturer
|
Dynatex
|
| Model
|
GST-150
|
|
|
Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
FBS Reservation Rules:
|
Advanced Res (days) |
Limit per Res (hrs) |
Limit per week (hrs)
|
| Weekday |
7 |
4 |
12
|
| Weeknight |
7 |
6 |
18
|
| Weekend |
14 |
6 |
18
|
For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.
Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.
Manufacturer Manuals
Specifications
Specifications
- Accommodated Sizes: up to 6" wafers
- Acceptable Materials: InP, GaAs, or Silicon substrates.
