Scriber-Breaker

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Scriber-Breaker
Dynatex-GST-150 Scriber-Breaker.jpg
Instrument Type Support Tools,
Substrate Processing
Techniques Wafer & Chip Scribing,
Scribe Breaking
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Scriber email list
Lab Location B213 Steele
Lab Phone 626-395-1537
Manufacturer Dynatex
Model GST-150

Description

The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.

Applications
  • Scribing and/or breaking wafers

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Specifications
  • Accommodated Sizes: up to 6" wafers
  • Acceptable Materials: InP, GaAs, or Silicon substrates.