Difference between revisions of "Equipment List"

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'''NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.'''
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== Lithography ==
 
== Lithography ==
 
===== Electron Beam Lithography =====
 
===== Electron Beam Lithography =====
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* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
 
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
 
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
 
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
 
 
===== Ion Beam Lithography =====
 
===== Ion Beam Lithography =====
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
 
===== Optical Lithography =====
 
===== Optical Lithography =====
* [[Suss MicroTec MA6 & MA6/BA6: Contact Mask Aligners | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
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* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[GCA 6300: i-Line Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
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* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[Heidelberg DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
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* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
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* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
 
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
 
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
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* [[Optical Lithography Resources]]
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== Deposition ==
 
== Deposition ==
 
===== Evaporation =====
 
===== Evaporation =====
* [[KJL Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
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* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
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* [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* [[Leica EM ACE600: Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
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* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
 
===== Sputtering =====
 
===== Sputtering =====
* [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]]
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* [[ATC Orion 8: Dielectric Sputter System | Dielectric Sputter System: AJA International ATC Orion 8]]
* [[ATC Orion 8: Chalcogenide Sputterer | Chalcogenide Sputterer: AJA International ATC Orion 8]]
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* [[ATC Orion 8: Chalcogenide Sputter System | Chalcogenide Sputter System: AJA International ATC Orion 8]]
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===== Chemical Vapor Deposition (CVD) =====
 
===== Chemical Vapor Deposition (CVD) =====
* [[Oxford FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
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* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Oxford 100: Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
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* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
 
===== Dielectric Packaging / Moisture Barrier =====
 
===== Dielectric Packaging / Moisture Barrier =====
* [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]
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* [[Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]
  
 
== Etching ==
 
== Etching ==
 
===== Dry Etching =====
 
===== Dry Etching =====
* [[Oxford 100 DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]]
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* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[Oxford 100 ICP–RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE]]
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* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[Oxford Dielectric 100 ICP–RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE]]
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* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Plasmatherm Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE]]
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* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
 
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
 
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
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===== Wet Etching =====
 
===== Wet Etching =====
* [[Wet Chemistry Techniques | Available Wet Chemistry Techniques]]
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* [[Wet Chemistry | Available Wet Etching Techniques]]
  
 
== Microscopy ==
 
== Microscopy ==
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===== KNI Microscopy Policies =====
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* [https://caltech.box.com/s/mpsxkxmf5y8wjw9daijwbudeoqkkeudu KNI Microscopy Policies]
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===== Guide to Choosing KNI SEMs & FIBs =====
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*[[Guide to Choosing KNI SEMs & FIBs | Consult this guide for help in choosing the best SEMs and FIBs for your work]]
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===== Focused Ion Beam (FIB) Systems =====
 
===== Focused Ion Beam (FIB) Systems =====
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | Helium, Neon & Gallium FIB: Zeiss ORION NanoFab]]
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
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* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
 
===== Scanning Electron Microscopes (SEMs) =====
 
===== Scanning Electron Microscopes (SEMs) =====
* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab]]
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* [[Nova 200 NanoLab: SEM, EDS & WDS | SEM & EDS: Thermo Fisher Nova 200 NanoLab]]
 
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
 
* [[Sirion: SEM & EDS | SEM & EDS: Thermo Fisher Sirion]]
 
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
 
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F]]
 
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
 
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab]]
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===== Transmission Electron Microscopes (TEMs) =====
 
===== Transmission Electron Microscopes (TEMs) =====
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)]]
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* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (80-200 kV)]]
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* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)]]
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===== Scanning Probe Microscopes =====
 
===== Scanning Probe Microscopes =====
 
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
 
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
* [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
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* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
  
 
===== Optical Characterization =====
 
===== Optical Characterization =====
* [[Woolam M-2000: Spectroscopic Ellipsometer | Spectroscopic Ellipsometry: Woolam M-2000]]
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* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
* [[Olympus BX51M with Filmetrics F40: Light Microscope | Light Microscope: Olympus BX51M with Filmetrics model F40]]
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* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
* [[Olympus IX81: Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
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* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
 
===== Sample Preparation for Microscopy =====
 
===== Sample Preparation for Microscopy =====
* [[Leica EM ACE600: Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
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* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
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== Wet Chemistry ==
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===== Wet Chemistry Main page=====
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* [[Wet Chemistry | Wet Chemistry page:]] - Facilities, Procedures & Safety, Chemical Lists
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===== Wet Chemistry Safety page=====
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* [[Wet Chemistry Safety | Wet Chemistry Safety page]] - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
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===== Wet Chemistry Resources page=====
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* [[Wet Chemistry Resources | Wet Chemistry Resources page]] - Contains fabrication recipes and procedures.
  
 
== Support Tools ==
 
== Support Tools ==
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===== Laboratory Data =====
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* [https://caltech.box.com/s/cl3ujgau2afl45joem7mg15e0oyxcgab General Laboratory Pass-down status information]
 
===== Thermal Processing =====
 
===== Thermal Processing =====
 
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
 
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
 
 
===== Substrate Processing =====
 
===== Substrate Processing =====
 
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
 
===== Device Processing =====
 
===== Device Processing =====
 
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
 
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
 
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
 
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
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===== Metrology =====
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* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
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* [[Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
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* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
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* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
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===== Sample Preparation =====
 
===== Sample Preparation =====
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
 
== Old Support Tools (Do not edit these) ==
 
===== Thermal Processing =====
 
* [[Tytan 1 & 2: Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
* [[RTP-600S: Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
 
* [[Jetfirst 150: Rapid Thermal Annealer | Rapid Thermal Annealer: Jipelec Jetfirst 150]]
 
===== Substrate Processing =====
 
* [[Dynatex GST-150: Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Suss MicroTec SB6L: Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[TA 915B: Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
===== Device Processing =====
 
* [[Westbond 7476D-79: Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
 
* [[Cascade Microtech M150: Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
 
===== Sample Preparation =====
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[Leica EM ACE600: Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Revision as of 01:19, 12 October 2021

NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography


Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

KNI Microscopy Policies
Guide to Choosing KNI SEMs & FIBs
Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Wet Chemistry

Wet Chemistry Main page
Wet Chemistry Safety page
  • Wet Chemistry Safety page - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.
Wet Chemistry Resources page

Support Tools

Laboratory Data
Thermal Processing
Substrate Processing
Device Processing
Metrology
Sample Preparation