Equipment List

NOTE: For EQUIPMENT TRAINING, contact the tool owner via Email for scheduling - DO NOT USE Labrunr - Training Sessions.

Lithography

Electron Beam Lithography

• Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
• Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
• Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
• Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)

Ion Beam Lithography

• He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)

Optical Lithography

• Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
• i-Line Wafer Stepper: GCA model 6300
• Nano Imprint Lithography: NILT CNI-PV 2.1
• Direct-Write Laser System: Heidelberg Instruments DWL-66
• Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
• Optical Lithography Resources

Deposition

Evaporation

• Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
• Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
• Carbon: Leica EM ACE600 Carbon Evaporator

Sputtering

• Dielectric Sputter System: AJA International ATC Orion 8
• Chalcogenide Sputter System: AJA International ATC Orion 8

Chemical Vapor Deposition (CVD)

• Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
• Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100

Dielectric Packaging / Moisture Barrier

• Parylene Coater: Para Tech LabTop 3000

Etching

Dry Etching

• Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
• III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
• Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
• Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
• Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
• XeF₂ Etcher for Silicon

Wet Etching

• Available Wet Etching Techniques

Microscopy

KNI Microscopy Policies

• KNI Microscopy Policies

Guide to Choosing KNI SEMs & FIBs

• Consult this guide for help in choosing the best SEMs and FIBs for your work

Focused Ion Beam (FIB) Systems

• Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
• SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab

Scanning Electron Microscopes (SEMs)

• SEM & EDS: Thermo Fisher Nova 200 NanoLab
• SEM & EDS: Thermo Fisher Sirion
• SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
• SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab

Transmission Electron Microscopes (TEMs)

• TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)
• TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)

Scanning Probe Microscopes

• Atomic Force Microscope (AFM): Bruker Dimension Icon
• Profilometer: Veeco Dektak 3ST

Optical Characterization

• Spectroscopic Ellipsometer: Woolam M-2000
• Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
• Fluorescence Microscope: Olympus IX81

Sample Preparation for Microscopy

• Carbon Evaporator (Leica EM ACE600) to make samples conductive
• Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
• TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill

Stubs for specimen mounting

• Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.

• • Buy stubs without copper clips

Wet Chemistry

Wet Chemistry Main page

• Wet Chemistry page: - Facilities, Procedures & Safety, Chemical Lists

Wet Chemistry Safety page

• Wet Chemistry Safety page - Requesting new chemical, PPE Overview, Hazardous Waste Handling and Labeling, Decanting Chemicals, Hot Plate Rules, Buddy System, Secondary Containment and Other Best Practices.

Wet Chemistry Resources page

• Wet Chemistry Resources page - Contains fabrication recipes and procedures.

Support Tools

Laboratory Data

• General Laboratory Pass-down status information

Thermal Processing

• Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
• Rapid Thermal Processing: Modular Process Technology RTP-600S

Substrate Processing

• Scriber-Breaker: Dynatex GST-150
• Wafer Bonder: Suss MicroTec model SB6L
• Critical Point Dryer: Tousimis Automegasamdri 915B

Device Processing

• Wedge-Wedge Wire Bonder: Westbond model 7476D-79
• Electrical Probing Station: Cascade Microtech M150

Metrology

• Spectroscopic Ellipsometer: Woolam M-2000
• Profilometer: Veeco Dektak 3ST
• Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
• Electrical Probing Station: Cascade Microtech M150

Sample Preparation

• TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
• Carbon Evaporator (Leica EM ACE600) to make samples conductive
• Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface