Equipment List

Lithography

Electron Beam Lithography

• Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
• Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
• Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
• Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)

Ion Beam Lithography

• He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)

Optical Lithography

• Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
• i-Line Wafer Stepper: GCA model 6300
• Direct-Write Laser System: Heidelberg Instruments DWL-66
• Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT

Deposition

Evaporation

• Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
• Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
• Carbon: Leica EM ACE600 Carbon Evaporator

Sputtering

• Dielectric Sputter System: AJA International ATC Orion 8
• Chalcogenide Sputter System: AJA International ATC Orion 8

Chemical Vapor Deposition (CVD)

• Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
• Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100

Dielectric Packaging / Moisture Barrier

• Parylene Coater: Para Tech LabTop 3000

Etching

Dry Etching

• Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
• III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
• Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
• Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
• Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
• XeF₂ Etcher for Silicon

Wet Etching

• Available Wet Etching Techniques

Microscopy

Focused Ion Beam (FIB) Systems

• Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
• SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab

Scanning Electron Microscopes (SEMs)

• SEM, EDS & WDS: Thermo Fisher Nova 200 NanoLab
• SEM & EDS: Thermo Fisher Sirion
• SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
• SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab

Transmission Electron Microscopes (TEMs)

• TEM, STEM, EDS & HAADF: Thermo Fisher Tecnai TF-30 (50-300 kV)
• TEM, STEM, EDS, EELS, EFTEM & Lithography: Thermo Fisher Tecnai TF-20 (40-200 kV)

Scanning Probe Microscopes

• Atomic Force Microscope (AFM): Bruker Dimension Icon
• Profilometer: Veeco Dektak 3ST

Optical Characterization

• Spectroscopic Ellipsometer: Woolam M-2000
• Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
• Fluorescence Microscope: Olympus IX81

Sample Preparation for Microscopy

• Carbon Evaporator (Leica EM ACE600) to make samples conductive
• Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
• TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill

Wet Chemistry

• Wet Chemistry Processes & Information
• Material Safety Data Sheets (MSDS) for all approved materials in the KNI Lab

Support Tools

Thermal Processing

• Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
• Rapid Thermal Processing: Modular Process Technology RTP-600S

Substrate Processing

• Scriber-Breaker: Dynatex GST-150
• Wafer Bonder: Suss MicroTec model SB6L
• Critical Point Dryer: Tousimis Automegasamdri 915B

Device Processing

• Wedge-Wedge Wire Bonder: Westbond model 7476D-79
• Electrical Probing Station: Cascade Microtech M150

Metrology

• Spectroscopic Ellipsometer: Woolam M-2000
• Profilometer: Veeco Dektak 3ST
• Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
• Electrical Probing Station: Cascade Microtech M150

Sample Preparation

• TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill
• Carbon Evaporator (Leica EM ACE600) to make samples conductive
• Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface