Equipment List: Difference between revisions
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===== Evaporation ===== | ===== Evaporation ===== | ||
* [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]] | * [[Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]] | ||
<!-- * [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] --> | <!--- * [[CHA: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator - DECOMMISSIONED]] ---> | ||
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | * [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | ||
* [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]] | * [[AJA Orion ATC Series Electron Beam Evaporator | Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator]] | ||
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* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
<!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]--- | <!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---> | ||
===== Stubs for specimen mounting ===== | ===== Stubs for specimen mounting ===== | ||
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===== Substrate Processing ===== | ===== Substrate Processing ===== | ||
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | * [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | ||
<!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]--- | <!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---> | ||
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | * [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | ||
===== Device Processing ===== | ===== Device Processing ===== | ||
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===== Sample Preparation ===== | ===== Sample Preparation ===== | ||
<!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]--- | <!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---> | ||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
Latest revision as of 03:15, 16 October 2025
NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions: FBS Instructions
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Nano Imprint Lithography: NILT CNI-PV 2.1
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
- Optical Lithography Resources
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
- Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator
Sputtering
- Dielectric Sputter System: AJA International ATC Orion 8
- Chalcogenide Sputter System: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
- III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
- Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
KNI Microscopy Policies
Microscopy High Performance PC
Guide to Choosing KNI SEMs & FIBs
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- Nova 200 NanoLab: SEM & EDS
- Sirion: SEM & EDS
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscope (TEM)
Scanning Probe Microscopes
Optical Characterization
- Digital Microscope and Camera: Keyence HVX-7000
- Fluorescence Microscope: Olympus IX81
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Spectroscopic Ellipsometer: Woolam M-2000
Sample Preparation for Microscopy
- Carbon Evaporator (Leica EM ACE600) to make samples conductive
- Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface
Stubs for specimen mounting
- Stubs used for mounting specimens are considered a personal, consumable item in the KNI. There are some stubs at each Microscope which can be used by any KNI microscopy user. You can also buy your own stubs so that you can keep them clean and available to you. There are many stub geometries and configurations. If you chose to buy your own stubs, please show them to the staff microscopist prior to using them: some stubs including stubs with copper clips have large height differences and can only be used safely in specific operating conditions.
Wet Chemistry
Wet Chemistry Main page
- Facilities Procedures & Safety
- List of Chemicals Supplied by KNI with Safety Data Sheets
- List of Chemicals Approved for use in the KNI cleanroom (not supplied by KNI) with Safety Data Sheets
- Requesting New Chemicals for use in the KNI cleanroom
Wet Chemistry Safety page
- PPE Overview
-Hazardous Waste Handling and Labeling
-Decanting Chemicals
-Hot Plate Rules
-KNI Buddy System
-Secondary Containment and Other Best Practices.
Wet Chemistry Resources page
- Contains fabrication recipes and procedures.
Support Tools
Equipment Status
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Solaris 150
Substrate Processing
Device Processing
Metrology
- Profilometer: Veeco Dektak 3ST
- Digital Microscope and Camera: Keyence HVX-7000
- Electrical Probing Station: Cascade Microtech M150
- Spectroscopic Ellipsometer: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Light Microscope Nikon L200 / Nikon Camera - Nikon L200/L200D Manual, Nikon L200 Operation Quick Reference