AJA Orion ATC Series Electron Beam Evaporator

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AJA Orion ATC Series Electron Beam Evaporator
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Instrument Type Deposition
Techniques E-beam Evaporation
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B235C Steele
Lab Phone 626-395-1539
Manufacturer AJA International
Model ATC Orion

Description

The AJA International ATC Orion Series system allows for electron beam evaporation of various metals, oxides, and semiconductors. This tool is a true UHV design equipped with dedicated heating jackets and internal heat lamps for an efficient bake-out process. A multi-crystal QCM protects against failed processes due to real-time thickness measurement errors and allows for long periods of maintained UHV conditions by removing the need to vent the chamber for regular sensor upkeep. In addition, crucibles may be swapped without breaking chamber vacuum via the use of a dedicated manual crucible exchanging system.

Applications
  • Metal deposition
  • Semiconductor deposition (in-situ doping not possible)
  • Oxide deposition
  • Lift-off

Resources

SOPs & Troubleshooting

Tool Reservation Rules

Advanced Reservation (days) Limit per Reservation (hrs) Limit per week (hrs)
Weekday 7 6 18
Weeknight 7 8 18
Weekend 7 12 18

Specifications

Hardware Specifications
  • Typical base pressure: <5E-9 Torr
  • All dry pumping system (cryo & scroll pumps)
  • Load-lock-equipped system with automatic wafer transfer
  • Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
    • Pockets 1-4 allow in-situ crucible exchange through dedicated secondary load lock, allowing for crucible swap without breaking UHV chamber conditions.
  • Accepts up to 1x 150mm wafer or smaller wafers/pieces
  • Optional lift-off dome holds 4x 100mm wafers for batch processing
  • Camera for E-Beam/Crucible observation during process
  • Inficon CrystalSix(TM)
    • 6-crystal QCM with automatic crystal switching in event of crystal fail or low Q. Enables long periods of maintained UHV conditions without requiring venting to exchange crystals
  • Programmable deposition processes

Related Instrumentation in the KNI

Sputtering Systems
Electron Beam Evaporation Systems
Chemical Vapor Deposition