Difference between revisions of "Equipment List"

From the KNI Lab at Caltech
Jump to navigation Jump to search
Line 31: Line 31:
 
===== Dry Etching =====
 
===== Dry Etching =====
 
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
 
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[ICP-RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
+
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
 
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
 
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
 
* [[Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
 
* [[Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]

Revision as of 20:53, 27 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Wet Chemistry

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Metrology
Sample Preparation