Difference between revisions of "Equipment List"

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* [[ICP-RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
 
* [[ICP-RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
 
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
 
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Plasmatherm Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE]]
+
* [[Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
 
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
 
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
 +
 
===== Wet Etching =====
 
===== Wet Etching =====
 
* [[Wet Chemistry | Available Wet Etching Techniques]]
 
* [[Wet Chemistry | Available Wet Etching Techniques]]

Revision as of 19:05, 27 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Wet Chemistry

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Metrology
Sample Preparation