Equipment List: Difference between revisions
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== Microscopy == | == Microscopy == | ||
===== KNI Microscopy Policies ===== | ===== KNI Microscopy Policies ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/rpbtox8l31qi3kw3b014e3e8i4ctjpdy KNI Microscopy Policies] | ||
===== Microscopy High Performance PC ===== | ===== Microscopy High Performance PC ===== | ||
| Line 83: | Line 83: | ||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | <!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---!> | ||
===== Stubs for specimen mounting ===== | ===== Stubs for specimen mounting ===== | ||
| Line 127: | Line 127: | ||
===== Substrate Processing ===== | ===== Substrate Processing ===== | ||
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | * [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | ||
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | <!---* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]---!> | ||
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | * [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | ||
===== Device Processing ===== | ===== Device Processing ===== | ||
| Line 141: | Line 141: | ||
===== Sample Preparation ===== | ===== Sample Preparation ===== | ||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | <!---* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]---!> | ||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | * [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] | ||
Revision as of 23:38, 14 October 2025
NOTE: For EQUIPMENT TRAINING, make a training request via FBS. See link to instructions: FBS Instructions
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Nano Imprint Lithography: NILT CNI-PV 2.1
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
- Optical Lithography Resources
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
- Metals & Oxides: AJA Orion ATC Series Electron Beam Evaporator
Sputtering
- Dielectric Sputter System: AJA International ATC Orion 8
- Chalcogenide Sputter System: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE
- III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE
- Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
KNI Microscopy Policies
Microscopy High Performance PC
Guide to Choosing KNI SEMs & FIBs
Focused Ion Beam (FIB) Systems
- Helium, Neon & Gallium FIB: Zeiss ORION NanoFab
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- Nova 200 NanoLab: SEM & EDS
- Sirion: SEM & EDS
- SEM, ESEM, Lithography & Probe Station: Thermo Fisher Quanta 200F
- SEM, Ga-FIB, GIS & Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscope (TEM)
Scanning Probe Microscopes
Optical Characterization
- Digital Microscope and Camera: Keyence HVX-7000
- Fluorescence Microscope: Olympus IX81
- Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer
- Spectroscopic Ellipsometer: Woolam M-2000