Difference between revisions of "Equipment List"

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* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
 
===== Optical Lithography =====
 
===== Optical Lithography =====
* [[Suss MicroTec MA6 & MA6/BA6: Contact Mask Aligners | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
+
* [[Contact Mask Aligners: MA6 & MA6/BA6: | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[GCA 6300: i-Line Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
+
* [[Wafer Stepper | i-Line Wafer Stepper: GCA model 6300]]
* [[Heidelberg DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
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* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
 
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
 
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
  

Revision as of 18:42, 27 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Wet Chemistry

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Metrology
Sample Preparation