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  1. Equipment List (167 revisions)
  2. Safety Data Sheets (SDS) (128 revisions)
  3. Usage Rates (127 revisions)
  4. EBPG 5200: 100 kV Electron Beam Lithography (116 revisions)
  5. Lab Rules & Safety (113 revisions)
  6. New Members (94 revisions)
  7. KNI Staff Members (88 revisions)
  8. EBPG 5000+: 100 kV Electron Beam Lithography (83 revisions)
  9. Optical Lithography Resources (77 revisions)
  10. Wet Chemistry (67 revisions)
  11. Sirion: SEM & EDS (66 revisions)
  12. Nova 200 NanoLab: SEM & EDS (66 revisions)
  13. ORION NanoFab: Helium, Neon & Gallium FIB (64 revisions)
  14. Lab Phone List (59 revisions)
  15. Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe (58 revisions)
  16. Wet Chemistry Resources (54 revisions)
  17. Matthew S. Hunt, PhD (50 revisions)
  18. Process Recipe Library (48 revisions)
  19. Rapid Thermal Processor (44 revisions)
  20. LabRunr Instructions (43 revisions)
  21. Quanta 200F: SEM, ESEM, Lithography & Probe Station (43 revisions)
  22. Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF (41 revisions)
  23. The Kavli Nanoscience Institute Laboratory at Caltech (40 revisions)
  24. Yonghwi Kim (38 revisions)
  25. Contact Mask Aligners: MA6 & MA6/BA6 (37 revisions)
  26. Carbon Evaporator (37 revisions)
  27. Wet Chemistry Safety (36 revisions)
  28. Provided Chemicals (33 revisions)
  29. ICP-RIE: Dielectric Etcher (31 revisions)
  30. DRIE: Bosch & Cryo ICP-RIE for Silicon (31 revisions)
  31. Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography (26 revisions)
  32. Dimension Icon: Atomic Force Microscope (AFM) (26 revisions)
  33. Wedge-Wedge Wire Bonder (26 revisions)
  34. ATC Orion 8: Dielectric Sputter System (26 revisions)
  35. Silicon Deposition: Oxford Instruments Plasmalab System 100 PECVD (25 revisions)
  36. Directions to the KNI Lab (25 revisions)
  37. FBS Instructions (24 revisions)
  38. Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner (24 revisions)
  39. FlexAL II: Atomic Layer Deposition (ALD) (23 revisions)
  40. Acknowledge the KNI (22 revisions)
  41. ICP-RIE: III-V, Metal & Silicon Etcher (22 revisions)
  42. Bert Mendoza (22 revisions)
  43. Dual Chamber RIE: Silicon, III-V Material & Organics Etcher (21 revisions)
  44. Wafer Stepper (21 revisions)
  45. Barry Baker (21 revisions)
  46. Scriber-Breaker (21 revisions)
  47. Nanoscribe PPGT: Microscale 3D Printer (19 revisions)
  48. Guide to Choosing KNI SEMs & FIBs (19 revisions)
  49. Wafer Bonder (17 revisions)
  50. Critical Point Dryer (17 revisions)

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