Provided Chemicals

Chemicals Provided by the KNI with typical SDS

• 495 PMMA Series Resists in Anisole
• 495 PMMA Series Resists in Chlorobenzene
• 950 PMMA Series Resists in Anisole
• 950 PMMA Series Resists in Chlorobenzene
• Acetic Acid Glacial
• Acetone
• Aluminum Etchant Type A
• Aluminum Etchant Type D
• Ammonium Hydroxide (NH₄OH)
• Anisole
• AZ 3330-F Photoresist
• AZ 400K Developer
• AZ 5214-E Photoresist
• AZ 726 MIF Developer
• AZ 9245 Photoresist
• AZ 9260 Photoresist
• AZ NLOF 2020 Photoresist
• AZ NLOF 2035 Photoresist
• AZ NLOF 2070 Photoresist
• AZ P4620 Photoresist
• CD 26 Developer
• Chromium Etchant CR-7S
• Citric Acid
• Copper Etchant APS-100
• Dichloromethane (Methylene Chlorine)
• Gold Etchant TFA
• Hexamethyldisilizane (HMDS)
• Hydrochloric Acid
• Hydrofluoric Acid (Buffered HF Improved - BHF)
• Hydrofluoric Acid 49%
• Hydrogen Peroxide, 30% H₂O₂
• Isopropyl Alcohol (IPA)
• Methanol (Methyl alcohol)
• Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
• MF 319 Developer
• NanoStrip - no longer available see Pure Strip
• PGMEA (Propylene glycol monomethyl ether acetate)
• Phosphoric Acid (H₃PO₄)
• Potassium Hydroxide
• Pure Strip (NanoStrip replacement)
• Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
• S1805 Photoresist
• S1813 Photoresist
• S1818 Photoresist
• SU-8 Developer
• Sulfuric Acid (H₂SO₄)
• Titanium Etchant TFT
• Titanium Etchant TFTN
• Tetramethylammonium Hydroxide 25% (TMAH)

All Approved Chemicals

• See List