Difference between revisions of "Usage Rates"

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!scope="col" style="text-align:center; width: 16%" | Corporate Rate**
!scope="col" style="text-align:center; width: 16%" | Corporate Rate**
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = EBPG 5000+
|EquipmentName = [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+]]
|EquipmentCategory = Lithography
|EquipmentCategory = Lithography
|CaltechRate = 62.00
|CaltechRate = 62.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = EBPG 5200
|EquipmentName = [[EBPG 5200: 100 kV Electron Beam Lithography | EBPG 5200]]
|EquipmentCategory = Lithography
|EquipmentCategory = Lithography
|CaltechRate = 62.00
|CaltechRate = 62.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Contact Mask Aligners
|EquipmentName = [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners]]
|EquipmentCategory = Lithography
|EquipmentCategory = Lithography
|CaltechRate = 36.00
|CaltechRate = 36.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Direct-Write Laser System (DWL-66)
|EquipmentName = [[DWL-66: Direct-Write Laser System | Direct-Write Laser System (DWL-66)]]
|EquipmentCategory = Lithography
|EquipmentCategory = Lithography
|CaltechRate = 47.00
|CaltechRate = 47.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Two-Photon Lithography (3D Printer)
|EquipmentName = [[Nanoscribe PPGT: Microscale 3D Printer | Nanoscribe (Microscale 3D Printer)]]
|EquipmentCategory = Lithography
|EquipmentCategory = Lithography
|CaltechRate = 8.00
|CaltechRate = 8.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Evaporator: Metals & Oxides (Mark 40)
|EquipmentName = [[CHA: Electron Beam Evaporator | Evaporator: Metals & Oxides (CHA)]]
|EquipmentCategory = Deposition
|EquipmentCategory = Deposition
|CaltechRate = 24.00
|CaltechRate = 24.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName =  Evaporator: Al, Au, Pt & Ti (Labline)
|EquipmentName =  [[Labline: Electron Beam Evaporator | Evaporator: Al, Au, Pt & Ti (Labline)]]
|EquipmentCategory = Deposition
|EquipmentCategory = Deposition
|CaltechRate = 24.00
|CaltechRate = 24.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Sputter: Chalcogenide Material
|EquipmentName = [[ATC Orion 8: Chalcogenide Sputter System | Sputter: Chalcogenide Material]]
|EquipmentCategory = Deposition
|EquipmentCategory = Deposition
|CaltechRate = 70.00
|CaltechRate = 70.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Sputter: Dielectric Material
|EquipmentName = [[ATC Orion 8: Dielectric Sputter System | Sputter: Dielectric Material]]
|EquipmentCategory = Deposition
|EquipmentCategory = Deposition
|CaltechRate = 37.00
|CaltechRate = 37.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Atomic Layer Deposition
|EquipmentName = [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD)]]
|EquipmentCategory = Deposition
|EquipmentCategory = Deposition
|CaltechRate = 67.00
|CaltechRate = 67.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = PECVD
|EquipmentName = [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | PECVD]]
|EquipmentCategory = Deposition
|EquipmentCategory = Deposition
|CaltechRate = 67.00
|CaltechRate = 67.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Silicon Etcher (DRIE)
|EquipmentName = [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher (DRIE)]]
|EquipmentCategory = Etching
|EquipmentCategory = Etching
|CaltechRate = 50.00
|CaltechRate = 50.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Silicon, III/V & Organics Etcher
|EquipmentName = [[ICP-RIE: III-V, Metal & Silicon Etcher| III-V, Metal & Silicon Etcher]]
|EquipmentCategory = Etching
|EquipmentCategory = Etching
|CaltechRate = 50.00
|CaltechRate = 50.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Dielectric Etcher
|EquipmentName = [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V & Organics Etcher]]
|EquipmentCategory = Etching
|EquipmentCategory = Etching
|CaltechRate = 50.00
|CaltechRate = 50.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = III/V, Metal & Silicon Etcher
|EquipmentName = [[ICP-RIE: Dielectric Etcher | Dielectric Etcher]]
|EquipmentCategory = Etching
|EquipmentCategory = Etching
|CaltechRate = 50.00
|CaltechRate = 50.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = XeF<sub>2</sub> Etcher for Silicon
|EquipmentName = [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
|EquipmentCategory = Etching
|EquipmentCategory = Etching
|CaltechRate = 50.00
|CaltechRate = 50.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = ORION NanoFab He/Ne/Ga-FIB
|EquipmentName = [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab He/Ne/Ga-FIB]]
|EquipmentCategory = Microscopy, Lithography
|EquipmentCategory = Microscopy, Lithography
|CaltechRate = 65.00
|CaltechRate = 65.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Nova 600 SEM/Ga-FIB
|EquipmentName = [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe | Nova 600 SEM/Ga-FIB]]
|EquipmentCategory = Microscopy
|EquipmentCategory = Microscopy
|CaltechRate = 65.00
|CaltechRate = 65.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Nova 200 SEM/EDS/WDS
|EquipmentName = [[Nova 200 NanoLab: SEM, EDS & WDS | Nova 200 SEM/EDS/WDS]]
|EquipmentCategory = Microscopy
|EquipmentCategory = Microscopy
|CaltechRate = 65.00
|CaltechRate = 65.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Sirion SEM/EDS
|EquipmentName = [[Sirion: SEM & EDS | Sirion SEM/EDS]]
|EquipmentCategory = Microscopy
|EquipmentCategory = Microscopy
|CaltechRate = 39.00
|CaltechRate = 39.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Quanta SEM/NPGS
|EquipmentName = [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta SEM/NPGS]]
|EquipmentCategory = Microscopy, Lithography
|EquipmentCategory = Microscopy, Lithography
|CaltechRate = 39.00
|CaltechRate = 39.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Tecnai TF-30 TEM/STEM
|EquipmentName = [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30 TEM/STEM]]
|EquipmentCategory = Microscopy
|EquipmentCategory = Microscopy
|CaltechRate = 97.00
|CaltechRate = 97.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Atomic Force Microscope (AFM)
|EquipmentName = [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM)]]
|EquipmentCategory = Microscopy
|EquipmentCategory = Microscopy
|CaltechRate = 41.00
|CaltechRate = 41.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Critical Point Dryer
|EquipmentName = [[Critical Point Dryer]]
|EquipmentCategory = Support Tools
|EquipmentCategory = Support Tools
|CaltechRate = 54.00
|CaltechRate = 54.00
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}}
}}
{{UsageRateTableItem|
{{UsageRateTableItem|
|EquipmentName = Tube Furnaces
|EquipmentName = [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces]]
|EquipmentCategory = Support Tools
|EquipmentCategory = Support Tools
|CaltechRate = 5.00
|CaltechRate = 5.00

Revision as of 23:08, 27 May 2019

The rates below are valid beginning October 2018 and are subject to change.

NOTE:

  • Rates for JPL, Non-Caltech Academic, Government, and Corporate KNI lab members are inclusive of FY19 Caltech F&A (i.e. "overhead") fees.
  • Individual Tools listed below are charged by the hour or portion thereof.
  • Precious Metal Usage (e.g. Au, Pt, etc.) is billed by the gram or portion thereof. The market prices are passed on to users and do not include Caltech overhead.

Equipment Rates

Name Category Caltech Rate JPL/Non-Caltech Acad/Govt Rate Corporate Rate**
EBPG 5000+
Lithography
$62.00
$101.99
$152.99
EBPG 5200
Lithography
$62.00
$101.99
$152.99
Contact Mask Aligners
Lithography
$36.00
$59.22
$88.83
Direct-Write Laser System (DWL-66)
Lithography
$47.00
$77.32
$115.97
Nanoscribe (Microscale 3D Printer)
Lithography
$8.00
$13.16
$19.74
Evaporator: Metals & Oxides (CHA)
Deposition
$24.00
$39.48
$59.22
Evaporator: Al, Au, Pt & Ti (Labline)
Deposition
$24.00
$39.48
$59.22
Sputter: Chalcogenide Material
Deposition
$70.00
$115.15
$172.73
Sputter: Dielectric Material
Deposition
$37.00
$60.87
$91.30
Atomic Layer Deposition (ALD)
Deposition
$67.00
$110.22
$165.32
PECVD
Deposition
$67.00
$110.22
$165.32
Silicon Etcher (DRIE)
Etching
$50.00
$82.25
$123.38
III-V, Metal & Silicon Etcher
Etching
$50.00
$82.25
$123.38
Silicon, III-V & Organics Etcher
Etching
$50.00
$82.25
$123.38
Dielectric Etcher
Etching
$50.00
$82.25
$123.38
XeF2 Etcher for Silicon
Etching
$50.00
$82.25
$123.38
ORION NanoFab He/Ne/Ga-FIB
Microscopy, Lithography
$65.00
$106.93
$160.39
Nova 600 SEM/Ga-FIB
Microscopy
$65.00
$106.93
$160.39
Nova 200 SEM/EDS/WDS
Microscopy
$65.00
$106.93
$160.39
Sirion SEM/EDS
Microscopy
$39.00
$64.16
$96.23
Quanta SEM/NPGS
Microscopy, Lithography
$39.00
$64.16
$96.23
Tecnai TF-30 TEM/STEM
Microscopy
$97.00
$159.57
$239.35
Atomic Force Microscope (AFM)
Microscopy
$41.00
$67.45
$101.17
Critical Point Dryer
Support Tools
$54.00
$88.83
$133.25
Tube Furnaces
Support Tools
$5.00
$8.23
$12.34
Monthly Base Rate*
General Equipment*
$655.00*
$1,077.48*
$1,616.21*

*Monthly Base Rate

The Monthly Base Rate is a flat fee charged per user, per month. It includes the use of:

Profilometers, Chemical Wet Benches, GST-150 Scriber-Breaker, M-2000 Spectroscopic Ellipsometer, Tecnai TF-20 TEM, GCA 6300 Stepper, Rapid Thermal Processor, Parylene Coater, SB6L Wafer Bonder, Wire Bonder, additional optical microscopes, related metrology, miscellaneous support tools and general supplies (e.g. gowning, chemicals, equipment reservation software, etc.).

**Corporate Memberships

For full information on the KNI's corporate membership plan, please send an email to tkimoto@caltech.edu with details regarding the number of people looking to join as KNI lab members, equipment needs, anticipated start date, and information about the company. Startup companies may qualify for limited-term reduced rates.