Difference between revisions of "Equipment List"

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* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
 
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)]]
 
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
 
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)]]
 
 
===== Ion Beam Lithography =====
 
===== Ion Beam Lithography =====
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
 
* [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 kV He & Ne, 1-30 kV Ga)]]
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* [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
 
* [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
 
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
 
* [[Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
 
 
===== Sputtering =====
 
===== Sputtering =====
 
* [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]]
 
* [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]]
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* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]]
 
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
 
* [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]]
 
 
===== Wet Etching =====
 
===== Wet Etching =====
* [[Wet Chemistry | Available Wet Chemistry Techniques]]
+
* [[Wet Chemistry | Available Wet Etching Techniques]]
  
 
== Microscopy ==
 
== Microscopy ==
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* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
 
* [[Dimension Icon: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension Icon]]
 
* [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
 
* [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
 
 
===== Optical Characterization =====
 
===== Optical Characterization =====
 
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
 
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
 
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
 
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
 
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
 
* [[Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]]
 
 
===== Sample Preparation for Microscopy =====
 
===== Sample Preparation for Microscopy =====
 
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
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 +
== Wet Chemistry ==
 +
* [[Wet Chemistry | Wet Chemistry Processes & Information]]
 +
* [[Lab Safety Data Sheets | Lab Safety Data Sheets (aka MSDS Sheets) for all approved materials in the KNI Lab]]
  
 
== Support Tools ==
 
== Support Tools ==
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* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
 
* [[Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
 
 
===== Substrate Processing =====
 
===== Substrate Processing =====
 
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
* [[Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
 
===== Device Processing =====
 
===== Device Processing =====
 
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
 
* [[Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
 +
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
 +
===== Metrology =====
 +
* [[Spectroscopic Ellipsometer | Spectroscopic Ellipsometer: Woolam M-2000]]
 +
* [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]]
 +
* [[Light Microscope with Spectroscopic Reflectometer | Light Microscope: Olympus BX51M with Filmetrics Spectroscopic Reflectometer]]
 
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
 
* [[Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
 
===== Sample Preparation =====
 
===== Sample Preparation =====

Revision as of 23:10, 22 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Wet Chemistry

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Metrology
Sample Preparation