Difference between revisions of "Equipment List"

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* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
 
== Old Support Tools (Do not edit these) ==
 
===== Thermal Processing =====
 
* [[Tytan 1 & 2: Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
* [[RTP-600S: Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]]
 
* [[Jetfirst 150: Rapid Thermal Annealer | Rapid Thermal Annealer: Jipelec Jetfirst 150]]
 
===== Substrate Processing =====
 
* [[Dynatex GST-150: Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]]
 
* [[Suss MicroTec SB6L: Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]]
 
* [[TA 915B: Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]]
 
===== Device Processing =====
 
* [[Westbond 7476D-79: Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]]
 
* [[Cascade Microtech M150: Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]]
 
===== Sample Preparation =====
 
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]]
 
* [[Leica EM ACE600: Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]]
 
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]
 
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]]

Revision as of 01:44, 22 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Sample Preparation