Difference between revisions of "Equipment List"

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== Etching ==
 
== Etching ==
 
===== Dry Etching =====
 
===== Dry Etching =====
* [[Oxford 100 DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]]
+
* [[DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]]
 
* [[Oxford 100 ICP–RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE]]
 
* [[Oxford 100 ICP–RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE]]
 
* [[Oxford Dielectric 100 ICP–RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE]]
 
* [[Oxford Dielectric 100 ICP–RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE]]

Revision as of 16:43, 21 May 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
Wet Etching

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
Scanning Probe Microscopes
Optical Characterization
Sample Preparation for Microscopy

Support Tools

Thermal Processing
Substrate Processing
Device Processing
Sample Preparation

Old Support Tools (Do not edit these)

Thermal Processing
Substrate Processing
Device Processing
Sample Preparation