Dual Chamber RIE: Silicon, III-V Material & Organics Etcher: Difference between revisions
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== Resources == | == Resources == | ||
===== Equipment | ===== Equipment Status ===== | ||
* [https://caltech. | * [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select RIE from the dropdown menu) | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/jsskat7yic4p7td31941dxuj97ja6er5 KNI SOP] | * [https://caltech.box.com/s/jsskat7yic4p7td31941dxuj97ja6er5 KNI SOP] |
Revision as of 05:32, 30 June 2022
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Description
The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon semiconductors with a traditional RIE process.
Applications
- Silicon Etching
- Organic Material Etching
Allowed Material in RIE
- Si, SixNy, SiO2, Ge
- PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
- Buried/backside metal ok if never exposed (not an etch stop)
RIE Gas List
- SF6
- CHF3
- CF4
- O2
- Ar
- He
- H2
Resources
Equipment Status
- LabRunr Equipment Status (Select RIE from the dropdown menu)
SOPs & Troubleshooting
Process Documents
Review Articles
- Guidelines for Etching Silicon MEMS Structures
- Etch rates for MEMS Processing - Part I
- Etch Rates for MEMS Processing - Part II
- Dry Etching of Electronic Oxides, Polymers, and Semiconductors
- Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars
Manufacturer Manuals
- In progress
Specifications
Manufacturer Specifications
- In progress
System Features
- In progress
System Specifications
- In progress