User contributions for Kmmckenz
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5 February 2024
- 20:2220:22, 5 February 2024 diff hist +54 m ICP-RIE: III-V, Metal & Silicon Etcher clarified allowed materials
22 August 2023
- 21:1621:16, 22 August 2023 diff hist +106 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher →SOPs & Troubleshooting: added reservation policy
- 21:1621:16, 22 August 2023 diff hist −3 ICP-RIE: Dielectric Etcher →SOPs & Troubleshooting: added reservation policy
- 21:1521:15, 22 August 2023 diff hist −3 ICP-RIE: III-V, Metal & Silicon Etcher →SOPs & Troubleshooting: added reservation policy
- 21:1521:15, 22 August 2023 diff hist −192 DRIE: Bosch & Cryo ICP-RIE for Silicon →SOPs & Troubleshooting: removed old and duplicate links
- 21:0621:06, 22 August 2023 diff hist +98 DRIE: Bosch & Cryo ICP-RIE for Silicon →SOPs & Troubleshooting: added reservation policy
- 21:0321:03, 22 August 2023 diff hist +99 Plasma-Enhanced Chemical Vapor Deposition (PECVD) →SOPs & Troubleshooting: added reservation policy
- 21:0221:02, 22 August 2023 diff hist +102 FlexAL II: Atomic Layer Deposition (ALD) →SOPs & Troubleshooting: added reservation policy current
24 April 2023
- 23:4523:45, 24 April 2023 diff hist +8 Tube Furnaces for Wet & Dry Processing →Allowed Materials: added SiNx
- 23:1123:11, 24 April 2023 diff hist −16 DRIE: Bosch & Cryo ICP-RIE for Silicon →Allowed material in DRIE: removed SiO2 from allowed etch materials
21 February 2023
- 21:3321:33, 21 February 2023 diff hist −206 Kelly McKenzie →Managed Equipment: removed plasma cleaner and XeF2 etcher current
- 21:3121:31, 21 February 2023 diff hist +2 m Kelly McKenzie →Education: updated pronouns
- 21:3021:30, 21 February 2023 diff hist +34 m Kelly McKenzie →Role in the KNI: updated pronouns
7 June 2022
- 22:1122:11, 7 June 2022 diff hist +1 Light Microscope with Spectroscopic Reflectometer No edit summary
28 April 2022
- 19:3619:36, 28 April 2022 diff hist +36 FlexAL II: Atomic Layer Deposition (ALD) Added to precursor list: BDEAS (silicon) (SDS coming soon)
15 April 2022
- 23:1323:13, 15 April 2022 diff hist +24 Tube Furnaces for Wet & Dry Processing added sapphire samples allowed
8 April 2022
- 17:3217:32, 8 April 2022 diff hist +485 Tube Furnaces for Wet & Dry Processing No edit summary
16 March 2022
- 23:3823:38, 16 March 2022 diff hist −25 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher removed * III-V Material Etching application
- 23:3823:38, 16 March 2022 diff hist −19 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher removed reference to etching III-V compounds
16 February 2022
- 19:4419:44, 16 February 2022 diff hist +2 Kelly McKenzie →Role in the KNI: edited Laboratory Technician to Plasma Process Engineer
21 December 2021
- 00:5500:55, 21 December 2021 diff hist 0 m Plasma-Enhanced Chemical Vapor Deposition (PECVD) fixed typo ("treeh" to "three")
- 00:5400:54, 21 December 2021 diff hist −557 Plasma-Enhanced Chemical Vapor Deposition (PECVD) Undo revision 2771 by Kmmckenz (talk) Tag: Undo
- 00:5200:52, 21 December 2021 diff hist +557 Plasma-Enhanced Chemical Vapor Deposition (PECVD) added Related Tools section
- 00:5100:51, 21 December 2021 diff hist +541 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher added Related Tools section
- 00:4900:49, 21 December 2021 diff hist +567 ICP-RIE: Dielectric Etcher added Related Tools section
- 00:4900:49, 21 December 2021 diff hist +558 ICP-RIE: III-V, Metal & Silicon Etcher added Related Tools section
- 00:4700:47, 21 December 2021 diff hist +558 DRIE: Bosch & Cryo ICP-RIE for Silicon added Related Tools section
17 November 2021
- 20:5720:57, 17 November 2021 diff hist −1,329 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher removed incorrect (Oxford ICP) system features, system specifications, manufacturer manual (qdp80 pump). Added "In progress" notes to the missing sections.
8 October 2021
- 17:2617:26, 8 October 2021 diff hist −200 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher removed incorrect (Oxford ICP) manufacturer specification, manufacturer manual links
21 September 2021
- 23:3123:31, 21 September 2021 diff hist +1 Tube Furnaces for Wet & Dry Processing update primary staff
- 23:3123:31, 21 September 2021 diff hist +1 Plasma-Enhanced Chemical Vapor Deposition (PECVD) update primary staff
- 23:3023:30, 21 September 2021 diff hist +1 m FlexAL II: Atomic Layer Deposition (ALD) update primary staff
- 23:2923:29, 21 September 2021 diff hist +1 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher update primary staff
- 23:2923:29, 21 September 2021 diff hist 0 m ICP-RIE: Dielectric Etcher update primary staff phone
- 23:2823:28, 21 September 2021 diff hist 0 m ICP-RIE: III-V, Metal & Silicon Etcher update primary staff phone
- 23:2823:28, 21 September 2021 diff hist 0 m DRIE: Bosch & Cryo ICP-RIE for Silicon update primary staff phone
- 23:2723:27, 21 September 2021 diff hist +1 ICP-RIE: Dielectric Etcher update primary staff
- 23:2723:27, 21 September 2021 diff hist +1 ICP-RIE: III-V, Metal & Silicon Etcher update primary staff
- 23:2623:26, 21 September 2021 diff hist 0 m DRIE: Bosch & Cryo ICP-RIE for Silicon capitalization of McKenzie