User contributions for Derose
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13 September 2019
- 14:5514:55, 13 September 2019 diff hist +527 EBPG 5200: 100 kV Electron Beam Lithography No edit summary
12 September 2019
- 18:4118:41, 12 September 2019 diff hist +88 EBPG 5000+: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
- 18:4118:41, 12 September 2019 diff hist +88 EBPG 5200: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
29 August 2019
- 21:3421:34, 29 August 2019 diff hist 0 EBPG 5200: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
- 21:3321:33, 29 August 2019 diff hist 0 EBPG 5000+: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
- 18:0518:05, 29 August 2019 diff hist 0 EBPG 5000+: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
- 18:0418:04, 29 August 2019 diff hist 0 EBPG 5200: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
- 15:0615:06, 29 August 2019 diff hist +82 EBPG 5200: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
- 15:0515:05, 29 August 2019 diff hist +82 EBPG 5000+: 100 kV Electron Beam Lithography →Sample Prep and Writing SOPs
25 June 2019
- 15:4315:43, 25 June 2019 diff hist 0 m EBPG 5000+: 100 kV Electron Beam Lithography →Specifications
- 15:4315:43, 25 June 2019 diff hist +140 EBPG 5000+: 100 kV Electron Beam Lithography →Manufacturer Manuals
- 15:4215:42, 25 June 2019 diff hist +140 m EBPG 5200: 100 kV Electron Beam Lithography →Resources
5 June 2019
- 15:2915:29, 5 June 2019 diff hist +480 EBPG 5000+: 100 kV Electron Beam Lithography →Resources
- 15:2815:28, 5 June 2019 diff hist +481 EBPG 5200: 100 kV Electron Beam Lithography →Resources
31 May 2019
- 21:4121:41, 31 May 2019 diff hist +19 EBPG 5000+: 100 kV Electron Beam Lithography →Troubleshooting SOPs
- 21:3921:39, 31 May 2019 diff hist +104 EBPG 5200: 100 kV Electron Beam Lithography →Troubleshooting SOPs
29 May 2019
- 18:1218:12, 29 May 2019 diff hist 0 m EBPG 5000+: 100 kV Electron Beam Lithography →Troubleshooting SOPs
- 17:2317:23, 29 May 2019 diff hist +628 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher →Resources
- 17:2217:22, 29 May 2019 diff hist +817 ICP-RIE: Dielectric Etcher →Resources
- 17:1417:14, 29 May 2019 diff hist +781 ICP-RIE: III-V, Metal & Silicon Etcher →Resources
- 16:3516:35, 29 May 2019 diff hist −1 m DRIE: Bosch & Cryo ICP-RIE for Silicon →Resources
- 16:3416:34, 29 May 2019 diff hist +783 DRIE: Bosch & Cryo ICP-RIE for Silicon →Resources
- 16:1316:13, 29 May 2019 diff hist +78 FlexAL II: Atomic Layer Deposition (ALD) →Manufacturer Manuals
- 16:0616:06, 29 May 2019 diff hist +472 FlexAL II: Atomic Layer Deposition (ALD) →Process Resources
- 14:3114:31, 29 May 2019 diff hist +173 FlexAL II: Atomic Layer Deposition (ALD) →Resources
- 14:2414:24, 29 May 2019 diff hist +6 Bert Mendoza →Role in the KNI
- 14:2214:22, 29 May 2019 diff hist +48 Guy A. DeRose, PhD →Role in the KNI current
- 14:2014:20, 29 May 2019 diff hist −15 Guy A. DeRose, PhD →Role in the KNI
28 May 2019
- 22:2222:22, 28 May 2019 diff hist 0 Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner →Manufacturer Specifications
- 22:1322:13, 28 May 2019 diff hist +34 Plasma-Enhanced Chemical Vapor Deposition (PECVD) →Manufacturer Manuals
- 22:0322:03, 28 May 2019 diff hist 0 ATC Orion 8: Chalcogenide Sputter System →Description
- 22:0122:01, 28 May 2019 diff hist +10 Bert Mendoza →Role in the KNI
- 21:5921:59, 28 May 2019 diff hist 0 ATC Orion 8: Dielectric Sputter System →Description
- 21:5721:57, 28 May 2019 diff hist 0 Carbon Evaporator →Manufacturer Specifications
- 21:5421:54, 28 May 2019 diff hist +9 FlexAL II: Atomic Layer Deposition (ALD) →Manufacturer Manuals
- 21:5221:52, 28 May 2019 diff hist +10 FlexAL II: Atomic Layer Deposition (ALD) →Manufacturer Manuals
- 21:4621:46, 28 May 2019 diff hist 0 DWL-66: Direct-Write Laser System →SOPs
- 21:2821:28, 28 May 2019 diff hist +525 FlexAL II: Atomic Layer Deposition (ALD) →Process Documents
- 20:5220:52, 28 May 2019 diff hist +40 Wet Chemistry →Safety Data Sheets (SDS)
- 20:5020:50, 28 May 2019 diff hist −21 Wet Chemistry →Resources
- 20:4920:49, 28 May 2019 diff hist +1,628 Wet Chemistry →Chemicals Provided by the KNI
- 20:0620:06, 28 May 2019 diff hist −43 ICP-RIE: III-V, Metal & Silicon Etcher →System Features
- 20:0120:01, 28 May 2019 diff hist +34 ICP-RIE: III-V, Metal & Silicon Etcher →Manufacturer Manuals
- 19:5019:50, 28 May 2019 diff hist +44 DRIE: Bosch & Cryo ICP-RIE for Silicon →Manufacturer Manuals
- 17:2817:28, 28 May 2019 diff hist −92 ICP-RIE: Dielectric Etcher →SOPs & Troubleshooting
- 17:2717:27, 28 May 2019 diff hist −92 DRIE: Bosch & Cryo ICP-RIE for Silicon →SOPs & Troubleshooting
- 17:1417:14, 28 May 2019 diff hist −174 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher →SOPs & Troubleshooting
- 17:1417:14, 28 May 2019 diff hist −499 Dual Chamber RIE: Silicon, III-V Material & Organics Etcher →Process Documents
- 16:4816:48, 28 May 2019 diff hist +58 Wet Chemistry →Description
- 16:4016:40, 28 May 2019 diff hist 0 m Lab Rules & Safety →KNI Documents