Nathan S. Lee: Difference between revisions

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===== Role in the KNI =====
===== Role in the KNI =====
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===== Education =====
===== Education =====
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== List of Managed Instruments ==
== List of Managed Instruments ==
===== Etching =====
===== Etching =====
* [[Oxford 100 DRIE: Bosch & Cryo ICP–RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE]]
* [[DRIE: Bosch & Cryo ICP-RIE for Silicon | Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP-RIE]]
* [[Oxford 100 ICP–RIE: III/V, Metal & Silicon Etcher | III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE]]
* [[ICP-RIE: III-V, Metal & Silicon Etcher | III-V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP-RIE]]
* [[Oxford Dielectric 100 ICP–RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE]]
* [[ICP-RIE: Dielectric Etcher | Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP-RIE]]
* [[Plasmatherm Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE]]
* [[Dual Chamber RIE: Silicon, III-V Material & Organics Etcher | Silicon, III-V Material & Organics Etcher: Plasma-Therm Dual Chamber RIE]]


===== Deposition =====
===== Deposition =====
* [[Oxford FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* [[Oxford 100: Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]


===== Support Tools =====
===== Support Tools =====
* [[Tystar Tytan 1 & 2: Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
* [[Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]]
 
== Other Notable Content ==
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== Personal ==
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Revision as of 22:34, 27 May 2019

Nathan S. Lee
Nathan-S-Lee.jpg
Title Plasma Process Engineer
Responsibilities Reactive-Ion Etching,
Plasma-Enhanced Deposition
Email nathslee@caltech.edu
Phone 626-395-1319 (office)
Office 319 Steele

About

Role in the KNI

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Education

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List of Managed Instruments

Etching
Deposition
Support Tools
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