Dual Chamber RIE: Silicon, III-V Material & Organics Etcher

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Dual Chamber RIE
Dual-Chamber-RIE Plasma-Therm-SLR.jpg
Instrument Type Etching
Techniques Silicon and
compound semiconductor
Reactive Ion Etching
Staff Manager Kelly McKenzie
Staff Email kmmckenz@caltech.edu
Staff Phone 626-395-5732
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B235 Steele
Lab Phone 626-395-1532
Manufacturer Plasma-Therm
Model SLR 720


The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon semiconductors with a traditional RIE process.

  • Silicon Etching
  • Organic Material Etching
Allowed Material in RIE
  • Si, SixNy, SiO2, Ge
  • PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
  • Buried/backside metal ok if never exposed (not an etch stop)
RIE Gas List
  • SF6
  • CHF3
  • CF4
  • O2
  • Ar
  • He
  • H2


Equipment Status
SOPs & Troubleshooting
Process Documents
Review Articles
Manufacturer Manuals
  • In progress


Manufacturer Specifications
  • In progress
System Features
  • In progress
System Specifications
  • In progress

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