DWL-66: Direct-Write Laser System

DWL-66 Direct-Write Laser System Instrument Type Lithography Techniques Direct Patterning, Pattern Alignment, Wafer and Mask Patterning Staff Manager Alex Wertheim Staff Email alexw@caltech.edu Staff Phone 626-395-3371 Reserve time on FBS Request training via FBS User Dashboard Lab Location B217 Steele Lab Phone 626-395-1536 Manufacturer Heidelberg Instruments Model DWL-66

Description

The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.

Applications

• Direct Writing
• Grayscale Writing

Resources

Equipment Data

• Lithography Pass-down equipment information

SOPs

• Operation SOP

Optical Lithography Resources

• Optical Lithography Resources Page

Manufacturer Manuals

• User Guide, Part 1
• User Guide, Part 2

Specifications

• Exposure: 442 nm wavelength HeCd laser

Related Instrumentation in the KNI

Electron Beam Lithography

• EBPG 5200: 100 kV Electron Beam Lithography
• EBPG 5000+: 100 kV Electron Beam Lithography
• Quanta 200F: SEM with 1-30 kV Electron Beam Lithography
• Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography

Ion Beam Lithography

• ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy

Optical Lithography

• Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
• i-Line Wafer Stepper: GCA model 6300
• Nano Imprint Lithography: NILT CNI-PV 2.1
• Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
• Optical Lithography Resources