DWL-66: Direct-Write Laser System: Difference between revisions
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===== SOPs ===== | ===== SOPs ===== | ||
* [https://caltech.box.com/s/y86tagq2ajxt16wnj5bmqwupas1f1bs7 Operation SOP] | * [https://caltech.box.com/s/y86tagq2ajxt16wnj5bmqwupas1f1bs7 Operation SOP] | ||
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Latest revision as of 22:55, 15 April 2024
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Description
The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.
Applications
- Direct Writing
- Grayscale Writing
Resources
SOPs
FBS Reservation Rules:
| Advanced Res (days) | Limit per Res (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 4 | 12 |
| Weeknight | 7 | 6 | 18 |
| Weekend | 14 | 6 | 18 |
For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.
Optical Lithography Resources
Manufacturer Manuals
Specifications
- Exposure: 442 nm wavelength HeCd laser
Related Instrumentation in the KNI
Electron Beam Lithography
- EBPG 5200: 100 kV Electron Beam Lithography
- EBPG 5000+: 100 kV Electron Beam Lithography
- Quanta 200F: SEM with 1-30 kV Electron Beam Lithography
- Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography