Wafer Stepper: Difference between revisions

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|Manufacturer = GCA
|Manufacturer = GCA
|Model = 6300
|Model = 6300
|Techniques = Wafer patterning,<br>Pattern alignments
|Techniques = Wafer Patterning,<br>Pattern Alignments
|EmailList = kni-photolith
|EmailList = kni-photolith
|EmailListName =  Photolithography
|EmailListName =  Photolithography
}}
}}
== Description ==
== Description ==
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2, 3, 4, 6, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain 0.1 °C temperature control.
The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.


Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X and Y coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X and Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.
===== Applications =====
===== Applications =====
* Step exposure with alignments
* Step exposure with alignments
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== Resources ==
== Resources ==
===== SOPs =====
=== Specifications ===
* [https://caltech.box.com/s/ufsyvbdxxhbnpkqjt7mashqmkyxsrq70 General SOP]
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* System is setup for 4 inch wafers and pieces smaller than 100mm.
 
=== Labrunr Reservation Rules:===
{| class="wikitable"
|-
!  !! Advanced Res (days) !! Limit per Res (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 4 || 12
|-
| Weeknight || 7 || 6 || 18
|-
| Weekend || 14 || 6 || 18
|}
'''  For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling.'''
''  Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.''
 
=== SOPs ===
* [https://caltech.box.com/s/z6q0ovarnkwe1sec645uq8kti44r4jwc GCA 6300 Operation Quick Guide Reference]
* [https://caltech.box.com/s/o634f2xum216ah4lrmxy67nurxbt5iqg GCA 6300 Operation SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
* [https://caltech.box.com/s/kdcnpkzlkb3sz42elrs07wq8wstr8pvr GCA 6300 Power-up SOP]
 
Manufacturer Manuals  
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/tq6pr3f9yldpfnr30kcx0jhre85541nz System Operation Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
* [https://caltech.box.com/s/87i1mym5d2nxluk4zim4wemf5zbhsm5w Advanced Operation & Utilization Manual]
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* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]
* [https://caltech.box.com/s/kqn62mmqrslz8x8bm2t7qqybjqulrosu Acceptance Test Procedures]


== Specifications ==
=== Optical Lithography Resources ===
* Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
* [[Optical Lithography Resources | Optical Lithography Resources Page]]
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Stepper from the dropdown menu)
 
== Related Instrumentation in the KNI ==
===== Optical Lithography =====
* [[Contact Mask Aligners: MA6 & MA6/BA6 | Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6]]
* [[CNI-PV 2.1: Nano Imprint Lithography | Nano Imprint Lithography: NILT CNI-PV 2.1]]
* [[DWL-66: Direct-Write Laser System | Direct-Write Laser System: Heidelberg Instruments DWL-66]]
* [[Nanoscribe PPGT: Microscale 3D Printer | Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT]]
* [[Optical Lithography Resources]]
===== Electron Beam Lithography =====
* [[EBPG 5200: 100 kV Electron Beam Lithography|EBPG 5200: 100 kV Electron Beam Lithography]]
* [[EBPG 5000+: 100 kV Electron Beam Lithography | EBPG 5000+: 100 kV Electron Beam Lithography]]
* [[Quanta 200F: SEM, ESEM, Lithography & Probe Station | Quanta 200F: SEM with 1-30 kV Electron Beam Lithography]]
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography]]
===== Ion Beam Lithography =====
* [[ORION NanoFab: Helium, Neon & Gallium FIB | ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy]]

Latest revision as of 05:36, 30 June 2022

Stepper
I-Line-Wafer-Stepper GCA-6300.jpg
Instrument Type Lithography
Techniques Wafer Patterning,
Pattern Alignments
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Lab Location B217 Steele
Lab Phone 626-395-1536
Manufacturer GCA
Model 6300

Description

The 6000 Series DSW Wafer Stepper wafer exposure system is fully automatic and capable of exposing an array of images directly on photoresist-coated wafers. Image field size is dependent on the lens selected for the user's particular application. The lens in this system is a Zeiss 10X with a maximum field size of 10 mm x 10 mm. This reduces the pattern from the reticle by a factor of 10 onto the substrate. The KNI stepper has paddles for wafer handling to accommodate 2-, 3-, 4-, 6-, and 8-inch wafers as well as pieces. The stepper is located inside of an environmental chamber set to maintain +/-0.1 °C temperature control.

Software allows conversational input dialogue to reduce errors and simplify the specification of complex operating parameters, a part of which permits selection of either circular of rectangular arrays on the wafer. A laser position transducer with automatic compensation for atmospheric conditions and work piece temperature is employed to meter X- & Y-coordinate stage positioning over a 150 mm x 150 mm (6 in x 6 in) square exposable area. Maximum throughput is assured through use of X- & Y-coordinate stage speeds of up to 50 mm (2 in) per second and exposures in both directions of travel (boustrophedonic stepping). The GCA 6300 at KNI has been fully refurbished by RZE Enterprises with a new PC and control electronics.

Applications
  • Step exposure with alignments
  • Step exposure without alignments

Resources

Specifications

  • Spectral Line: 365 nm wavelength (aka "i-line") via Hg lamp
  • System is setup for 4 inch wafers and pieces smaller than 100mm.

Labrunr Reservation Rules:

Advanced Res (days) Limit per Res (hrs) Limit per week (hrs)
Weekday 7 4 12
Weeknight 7 6 18
Weekend 14 6 18

For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.

SOPs

Manufacturer Manuals

Optical Lithography Resources

Equipment Status

Related Instrumentation in the KNI

Optical Lithography
Electron Beam Lithography
Ion Beam Lithography
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