Difference between revisions of "Labline: Electron Beam Evaporator"

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== Resources ==
== Resources ==
===== Equipment Data =====
===== Equipment Status =====
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information]
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Ebeam_Lesker from the dropdown menu)
 
===== SOPs & Troubleshooting =====
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]

Latest revision as of 05:25, 30 June 2022

Labline Evaporator
KJLC-Labline-Metal-Evaporator.jpg
Instrument Type Deposition
Techniques E-beam Evaporation,
Ion-Assisted Deposition (IAD),
Ion Milling
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Labline email list
Lab Location B235C Steele
Lab Phone 626-395-1539
Manufacturer Kurt J. Lesker Company
Model Labline

Description

The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

Applications
  • Metal deposition (Ti, Pt, Au, Al)
  • Lift-off
  • Non-selective etch
  • Ion-assisted deposition (simultaneous etching & deposition)

Resources

Equipment Status
SOPs & Troubleshooting

Tool Reservation Rules

Advanced Reservation (days) Limit per Reservation (hrs) Limit per week (hrs)
Weekday 7 6 18
Weeknight 7 8 18
Weekend 7 12 18
Video Tutorials

Specifications

Hardware Specifications
  • Typical base pressure: 1E-7 to 1E-8 Torr
  • All dry pumping system (cryo & scroll pumps)
  • Load-lock-equipped system with manual wafer transfer
  • Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
  • 1x Argon ion source (Filament type)
  • Accepts up to 1x 150mm wafer or smaller wafers/pieces

Related Instrumentation in the KNI

Sputtering Systems
Electron Beam Evaporation Systems
Chemical Vapor Deposition