Difference between revisions of "Equipment List"
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* [[Plasmatherm Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE]] | * [[Plasmatherm Dual Chamber RIE: Silicon, III/V Material & Organics Etcher | Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE]] | ||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | * [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE]] | ||
* [[ | * [[XeF2 Etcher for Silicon | XeF<sub>2</sub> Etcher for Silicon]] | ||
===== Wet Etching ===== | ===== Wet Etching ===== | ||
Revision as of 17:08, 23 April 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Etcher for Silicon
Wet Etching
Microscopy
Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
- SEM/EDS/WDS: Thermo Fisher Nova 200 NanoLab
- SEM/EDS: Thermo Fisher Sirion
- SEM/ESEM: Thermo Fisher Quanta 200F
- SEM/Ga-FIB/GIS/Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B