Difference between revisions of "CHA: Electron Beam Evaporator"
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|Model = Mark 40 | |Model = Mark 40 | ||
|Techniques = E-beam Evaporation | |Techniques = E-beam Evaporation | ||
|EmailList = cha | |EmailList = kni-cha | ||
|EmailListName = E-beam Evaporator | |EmailListName = E-beam Evaporator | ||
}} | }} | ||
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== Resources == | == Resources == | ||
===== Equipment Status ===== | |||
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Ebeam_CHA from the dropdown menu) | |||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP] | * [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP] | ||
* [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide] | * [https://caltech.box.com/s/alx89163hok9gqg5vocsvhk0y74xd5xh Troubleshooting Guide] | ||
* [https://caltech.box.com/s/qp616ky1g083wqfeb1nokp4jtnqjifkc QCM Crystal Sensor Replacement Instructions] | |||
* [https://caltech.box.com/s/e0oelbvt8cj4fg9bemitidnwee068qrn E-beam Process Maintenance Guide] | |||
* [https://caltech.box.com/s/0ulhxthe9i465bpzinugiiefmfy6t0rb Materials Filling and Crucible Swap Instructions] | |||
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles. | |||
=== Tool Reservation Rules === | |||
{| class="wikitable" | |||
|- | |||
! !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs) | |||
|- | |||
| Weekday || 7 || 6 || 12 | |||
|- | |||
| Weeknight || 7 || 12 || 12 | |||
|- | |||
| Weekend || 14 || 12 || 12 | |||
|} | |||
===== Video Tutorials ===== | ===== Video Tutorials ===== | ||
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* All dry pumping system (cryo & dry mechanical pump) | * All dry pumping system (cryo & dry mechanical pump) | ||
* Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source | * Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source | ||
== Related Instrumentation in the KNI == | |||
===== Sputtering Systems ===== | |||
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]] | |||
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]] | |||
===== Electron Beam Evaporation Systems ===== | |||
* [[Labline: Electron Beam Evaporator|Labline: Electron Beam Evaporator]] | |||
===== Chemical Vapor Deposition ===== | |||
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]] | |||
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]] | |||
Revision as of 05:26, 30 June 2022
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Description
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.
Applications
- Metal & Oxide Deposition
- Lift-off
- Etch Hard-mask Formation
Resources
Equipment Status
- LabRunr Equipment Status (Select Ebeam_CHA from the dropdown menu)
SOPs & Troubleshooting
- KNI SOP
- Troubleshooting Guide
- QCM Crystal Sensor Replacement Instructions
- E-beam Process Maintenance Guide
- Materials Filling and Crucible Swap Instructions
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.
Tool Reservation Rules
| Advanced Reservation (days) | Limit per Reservation (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 6 | 12 |
| Weeknight | 7 | 12 | 12 |
| Weekend | 14 | 12 | 12 |
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-6 to 1E-7 Torr
- All dry pumping system (cryo & dry mechanical pump)
- Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source