Difference between revisions of "Equipment List"
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= Microscopy = | = Microscopy = | ||
===== Focused Ion Beam (FIB) Systems ===== | ===== Focused Ion Beam (FIB) Systems ===== | ||
* He/Ne/Ga-FIB: Zeiss ORION NanoFab | * [[ORION NanoFab: Helium, Neon & Gallium FIB | He/Ne/Ga-FIB: Zeiss ORION NanoFab]] | ||
* [[ | * [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM/Ga-FIB/GIS/Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Scanning Electron Microscopes (SEMs) ===== | ===== Scanning Electron Microscopes (SEMs) ===== | ||
* SEM/EDS/WDS: Thermo Fisher Nova 200 NanoLab | * [[Nova 200 NanoLab: SEM, EDS & WDS | SEM/EDS/WDS: Thermo Fisher Nova 200 NanoLab]] | ||
* SEM/EDS: Thermo Fisher Sirion | * [[Sirion: SEM & EDS | SEM/EDS: Thermo Fisher Sirion]] | ||
* SEM/ESEM: Thermo Fisher Quanta 200F | * [[Quanta 200F: SEM, ESEM & Probe Station | SEM/ESEM: Thermo Fisher Quanta 200F]] | ||
* [[ | * [[Nova_600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|SEM/Ga-FIB/GIS/Omniprobe: Thermo Fisher Nova 600 NanoLab]] | ||
===== Transmission Electron Microscopes (TEMs) ===== | ===== Transmission Electron Microscopes (TEMs) ===== | ||
* TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV) | * [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)]] | ||
* TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV) | * [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)]] | ||
===== Scanning Probe Microscopes ===== | ===== Scanning Probe Microscopes ===== | ||
* Atomic Force Microscope (AFM): Bruker Dimension ICON | * [[Dimension ICON: Atomic Force Microscope (AFM) | Atomic Force Microscope (AFM): Bruker Dimension ICON]] | ||
* Profilometer: Veeco Dektak 3ST | * [[Veeco Dektak 3ST: Profilometer | Profilometer: Veeco Dektak 3ST]] | ||
===== Optical Characterization ===== | ===== Optical Characterization ===== | ||
* Spectroscopic Ellipsometry: Woolam M-2000 | * [[Woolam M-2000: Spectroscopic Ellipsometer | Spectroscopic Ellipsometry: Woolam M-2000]] | ||
* Light Microscope: Olympus BX51M with Filmetrics model F40 | * [[Olympus BX51M with Filmetrics F40: Light Microscope | Light Microscope: Olympus BX51M with Filmetrics model F40]] | ||
* Fluorescence Microscope: Olympus IX81 | * [[Olympus IX81: Fluorescence Microscope | Fluorescence Microscope: Olympus IX81]] | ||
= Support Tools = | = Support Tools = | ||
===== Thermal Processing ===== | ===== Thermal Processing ===== | ||
* Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing) | * [[Tystar Tytan 1 & 2: Tube Furnaces for Wet & Dry Processing | Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)]] | ||
* Rapid Thermal Processing: Modular Process Technology RTP-600S | * [[RTP-600S: Rapid Thermal Processor | Rapid Thermal Processing: Modular Process Technology RTP-600S]] | ||
* Rapid Thermal Annealer: Jipelec Jetfirst 150 | * [[Jipelec Jetfirst 150: Rapid Thermal Annealer | Rapid Thermal Annealer: Jipelec Jetfirst 150]] | ||
===== Substrate Processing ===== | ===== Substrate Processing ===== | ||
* Scriber-Breaker: Dynatex GST-150 | * [[Dynatex GST-150: Scriber-Breaker | Scriber-Breaker: Dynatex GST-150]] | ||
* Wafer Bonder: Suss MicroTec model SB6L | * [[Suss MicroTec SB6L: Wafer Bonder | Wafer Bonder: Suss MicroTec model SB6L]] | ||
* Critical Point Dryer: Tousimis Automegasamdri 915B | * [[TA 915B: Critical Point Dryer | Critical Point Dryer: Tousimis Automegasamdri 915B]] | ||
===== Device Processing ===== | ===== Device Processing ===== | ||
* Wedge-Wedge Wire Bonder: Westbond model 7476D-79 | * [[Westbond 7476D-79: Wedge-Wedge Wire Bonder | Wedge-Wedge Wire Bonder: Westbond model 7476D-79]] | ||
* Electrical Probing Station: Cascade Microtech M150 | * [[Cascade Microtech M150: Electrical Probing Station | Electrical Probing Station: Cascade Microtech M150]] |
Revision as of 17:08, 23 April 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- [[XeF2 Etcher for Silicon | XeF2 Etcher for Silicon]]
Wet Etching
Microscopy
Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
- SEM/EDS/WDS: Thermo Fisher Nova 200 NanoLab
- SEM/EDS: Thermo Fisher Sirion
- SEM/ESEM: Thermo Fisher Quanta 200F
- SEM/Ga-FIB/GIS/Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B