Dual Chamber RIE: Silicon, III-V Material & Organics Etcher: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
|||
Line 30: | Line 30: | ||
===== RIE Gas List ===== | ===== RIE Gas List ===== | ||
* SF<sub>6</sub> | * SF<sub>6</sub> | ||
* | * CHF<sub>3</sub> | ||
* CF<sub>4</sub> | |||
* O<sub>2</sub> | * O<sub>2</sub> | ||
* Ar | * Ar | ||
* | * He | ||
* H<sub>2</sub> | |||
== Resources == | == Resources == |
Revision as of 17:11, 28 May 2019
|
Description
The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon and III-V compound semiconductors with a traditional RIE process.
Applications
- Silicon Etching
- III-V Material Etching
- Organic Material Etching
Allowed Material in RIE
- Si, SixNy, SiO2, Ge
- PMMA/ZEP/SPR/AZ/maN resists, SiOx/Al2O3 hard masks
- Buried/backside metal ok if never exposed (not an etch stop)
RIE Gas List
- SF6
- CHF3
- CF4
- O2
- Ar
- He
- H2
Resources
SOPs & Troubleshooting
Process Documents
- Process Standards
- Silicon Waveguide Etch
- Bosch Si Etch
- High-Rate Bosch Si Etch
- Cryo-Si Etch
- Isotropic Si Etch
- Etch chamber cleaning recipes
Manufacturer Manuals
Specifications
Manufacturer Specifications
System Features
- Universal base console which houses the electronic sub systems, control units, pneumatics, and turbomolecular pump
- PC 2000 Operating system
- ICP process chamber with 200 mm pumping port, view port and end-point-detection ports for optical emission spectrometer and laser interferometer
- Variable height 240 mm Cryo RIE electrode
- Parameter ramping software
- 100 mTorr, temperature-stabilized capacitance manometer for process control with an active penning gauge for base pressure measurement
- 200 mm pumping port is fitted with a 200 mm variable gate valve for chamber isolation and process pressure control
- Close-coupled gas pod to ICP for two digital non-toxic mass-flow-controlled gas lines (SF6, and C4F8)
- Six line gas pod with 3 non-toxic digital mass-flow-controlled gas lines
- Alcatel 1300 l/s MAGLEV turbo pump
- Single-wafer automatic insertion load lock with soft pump option
- Single user license for Anisotropic Silicon Etch Process (Bosch)
System Specifications
- Chamber wall heating 80 °C
- Cryo table range -150 to 400 °C
- ICP 380mm remote high-density plasma source with 8 kW RF generator and automatic matching unit close-coupled to the source.
- Substrate bias control by 30 / 300 W RIE source
- Helium back-side wafer cooling