Difference between revisions of "CHA: Electron Beam Evaporator"
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! | ! _ !! Advanced Reservation (days) !!! Limit per Reservation (hrs) !!!! Limit per week (hrs) | ||
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| Weekday || 7 ||| 6 |||| 12 | | Weekday || 7 ||| 6 |||| 12 | ||
Revision as of 22:46, 25 June 2020
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Description
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.
Applications
- Metal & Oxide Deposition
- Lift-off
- Etch Hard-mask Formation
Resources
SOPs & Troubleshooting
- KNI SOP
- Troubleshooting Guide
- QCM Crystal Sensor Replacement Instructions
- E-beam Process Maintenance Guide
- Materials Filling and Crucible Swap Instructions
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.
Tool Reservation Rules
| _ | Advanced Reservation (days) | ! Limit per Reservation (hrs) | Limit per week (hrs) | |
|---|---|---|---|---|
| Weekday | 7 | 6 | 12 | |
| Weeknight | 7 | 12 | 12 | |
| Weekend | 14 | 12 | 12 |
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-6 to 1E-7 Torr
- All dry pumping system (cryo & dry mechanical pump)
- Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source