CHA: Electron Beam Evaporator: Difference between revisions
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== Resources == | == Resources == | ||
===== Equipment Data ===== | |||
* [https://caltech.box.com/s/lul90odaqj4rp9inb6qt2mft2ean0qqa Deposition Pass-down equipment information] | |||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP] | * [https://caltech.box.com/s/4i2s0kvp6euf2ngx38cr99etfm0gagh0 KNI SOP] | ||
Revision as of 05:16, 1 August 2020
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Description
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.
Applications
- Metal & Oxide Deposition
- Lift-off
- Etch Hard-mask Formation
Resources
Equipment Data
SOPs & Troubleshooting
- KNI SOP
- Troubleshooting Guide
- QCM Crystal Sensor Replacement Instructions
- E-beam Process Maintenance Guide
- Materials Filling and Crucible Swap Instructions
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.
Tool Reservation Rules
| Advanced Reservation (days) | Limit per Reservation (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 6 | 12 |
| Weeknight | 7 | 12 | 12 |
| Weekend | 14 | 12 | 12 |
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-6 to 1E-7 Torr
- All dry pumping system (cryo & dry mechanical pump)
- Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source