CHA: Electron Beam Evaporator: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
No edit summary |
||
Line 13: | Line 13: | ||
|Model = Mark 40 | |Model = Mark 40 | ||
|Techniques = E-beam Evaporation | |Techniques = E-beam Evaporation | ||
|EmailList = cha-labline | |EmailList = cha-labline | ||
|EmailListName = E-beam Evaporator | |EmailListName = E-beam Evaporator | ||
}} | }} |
Revision as of 21:39, 20 February 2020
|
Description
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.
Applications
- Metal & Oxide Deposition
- Lift-off
- Etch Hard-mask Formation
Resources
SOPs & Troubleshooting
Use the process maintenance guide above for help with assessing and maintaining evaporation crucibles.
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-6 to 1E-7 Torr
- All dry pumping system (cryo & dry mechanical pump)
- Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source