Labline: Electron Beam Evaporator

Labline Evaporator Instrument Type Deposition Techniques E-beam Evaporation, Ion-Assisted Deposition (IAD), Ion Milling Staff Manager Alex Wertheim Staff Email alexw@caltech.edu Staff Phone 626-395-3371 Reserve time on FBS Request training via FBS User Dashboard Lab Location B235C Steele Lab Phone 626-395-1539 Manufacturer Kurt J. Lesker Company Model Labline

Description

The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

Applications

• Metal deposition (Ti, Pt, Au, Al)
  • Other materials may be available upon request with restrictions: metals such as Cr, Fe, Ni, Co are not available. If you wish to deposit these see the links to related systems on this page.
• Lift-off
• Non-selective etch
• Ion-assisted deposition (simultaneous etching & deposition)

Resources

SOPs & Troubleshooting

• KNI SOP
• Troubleshooting Guide

Tool Reservation Rules

	Advanced Reservation (days)	Limit per Reservation (hrs)	Limit per week (hrs)
Weekday	7	6	18
Weeknight	7	8	18
Weekend	7	12	18

Video Tutorials

• Labline Training
• Sample Load & Transfer

Specifications

Hardware Specifications

• Typical base pressure: 1E-7 to 1E-8 Torr
• All dry pumping system (cryo & scroll pumps)
• Load-lock-equipped system with manual wafer transfer
• Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
• 1x Argon ion source (Filament type)
• Accepts up to 1x 150mm wafer or smaller wafers/pieces

Related Instrumentation in the KNI

Sputtering Systems

• ATC Orion 8: Chalcogenide Sputter System
• ATC Orion 8: Dielectric Sputter System

Electron Beam Evaporation Systems

• AJA Orion ATC Series Electron Beam Evaporator

Chemical Vapor Deposition

• FlexAL II: Atomic Layer Deposition (ALD)
• Plasma-Enhanced Chemical Vapor Deposition (PECVD)