Labline: Electron Beam Evaporator: Difference between revisions
		
		
		
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				m (Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg)  | 
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{{InstrumentInfoboxOneImage|  | {{InstrumentInfoboxOneImage|  | ||
|InstrumentName = Labline   | |InstrumentName = Labline Evaporator  | ||
|HeaderColor = #F2682A  | |HeaderColor = #F2682A  | ||
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg  | |ImageOne = KJLC-Labline-Metal-Evaporator.jpg  | ||
|ImageTwo =    | |ImageTwo =    | ||
|InstrumentType = [[Equipment_List#Deposition|Deposition]]  | |InstrumentType = [[Equipment_List#Deposition|Deposition]]  | ||
|RoomLocation =   | |RoomLocation = B235C Steele  | ||
|LabPhone = 626-395-1539  | |LabPhone = 626-395-1539  | ||
|PrimaryStaff = [[Alex Wertheim]]  | |PrimaryStaff = [[Alex Wertheim]]  | ||
| Line 13: | Line 13: | ||
|Model = Labline  | |Model = Labline  | ||
|Techniques = E-beam Evaporation,<br>Ion-Assisted Deposition (IAD),</br>Ion Milling  | |Techniques = E-beam Evaporation,<br>Ion-Assisted Deposition (IAD),</br>Ion Milling  | ||
|EmailList = kni-labline  | |EmailList = kni-labline  | ||
|EmailListName =  Labline  | |EmailListName =  Labline  | ||
}}  | }}  | ||
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* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]  | * [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]  | ||
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]  | * [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]  | ||
=== Tool Reservation Rules ===  | |||
{| class="wikitable"  | |||
|-  | |||
!  !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)  | |||
|-  | |||
| Weekday || 7 || 6 || 18  | |||
|-  | |||
| Weeknight || 7 || 8 || 18  | |||
|-  | |||
| Weekend || 7 || 12 || 18  | |||
|}  | |||
===== Video Tutorials =====  | ===== Video Tutorials =====  | ||
* [https://youtu.be/jq5M7fkgpfM Labline Training]  | * [https://youtu.be/jq5M7fkgpfM Labline Training]  | ||
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]  | |||
== Specifications ==  | == Specifications ==  | ||
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* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source  | * Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source  | ||
* 1x Argon ion source (Filament type)  | * 1x Argon ion source (Filament type)  | ||
* Accepts up to 1x 150mm wafer or smaller wafers/pieces  | |||
== Related Instrumentation in the KNI ==  | |||
===== Sputtering Systems =====  | |||
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]  | |||
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]  | |||
===== Electron Beam Evaporation Systems =====  | |||
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]  | |||
===== Chemical Vapor Deposition =====  | |||
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]  | |||
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]  | |||
Latest revision as of 23:24, 15 April 2024
  | 
Description
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.
Applications
- Metal deposition (Ti, Pt, Au, Al)
 - Lift-off
 - Non-selective etch
 - Ion-assisted deposition (simultaneous etching & deposition)
 
Resources
SOPs & Troubleshooting
Tool Reservation Rules
| Advanced Reservation (days) | Limit per Reservation (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 6 | 18 | 
| Weeknight | 7 | 8 | 18 | 
| Weekend | 7 | 12 | 18 | 
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-7 to 1E-8 Torr
 - All dry pumping system (cryo & scroll pumps)
 - Load-lock-equipped system with manual wafer transfer
 - Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
 - 1x Argon ion source (Filament type)
 - Accepts up to 1x 150mm wafer or smaller wafers/pieces
 
