Labline: Electron Beam Evaporator: Difference between revisions
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* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source | * Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source | ||
* 1x Argon ion source (Filament type) | * 1x Argon ion source (Filament type) | ||
== Related Instrumentation in the KNI == | |||
===== Sputtering Systems ===== | |||
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]] | |||
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]] | |||
===== Electron Beam Evaporation Systems ===== | |||
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]] | |||
===== Chemical Vapor Deposition ===== | |||
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]] | |||
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]] |
Revision as of 21:16, 20 September 2019
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Description
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.
Applications
- Metal deposition (Ti, Pt, Au, Al)
- Lift-off
- Non-selective etch
- Ion-assisted deposition (simultaneous etching & deposition)
Resources
SOPs & Troubleshooting
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-7 to 1E-8 Torr
- All dry pumping system (cryo & scroll pumps)
- Load-lock-equipped system with manual wafer transfer
- Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
- 1x Argon ion source (Filament type)