Difference between revisions of "XeF2 Etcher for Silicon"
Jump to navigation
Jump to search
m (→Description) |
|||
| (5 intermediate revisions by 3 users not shown) | |||
| Line 1: | Line 1: | ||
{{InstrumentInfoboxOneImage| | {{InstrumentInfoboxOneImage| | ||
|InstrumentName = XeF<sub>2</sub> Silicon Etcher | |InstrumentName = XeF<sub>2</sub> Silicon Etcher | ||
|HeaderColor = # | |HeaderColor = #FFE2B9 | ||
|ImageOne = XeF2-Etcher.jpg | |ImageOne = XeF2-Etcher.jpg | ||
|ImageTwo = | |ImageTwo = | ||
|InstrumentType = [[Equipment_List#Etching|Etching]] | |InstrumentType = [[Equipment_List#Etching|Etching]] | ||
|RoomLocation = | |RoomLocation = B235C Steele | ||
|LabPhone = 626-395-1539 | |LabPhone = 626-395-1539 | ||
|PrimaryStaff = [[Alex Wertheim]] | |PrimaryStaff = [[Alex Wertheim]] | ||
| Line 14: | Line 14: | ||
|Techniques = Selective dry Si etching | |Techniques = Selective dry Si etching | ||
|RequestTraining = alexw@caltech.edu | |RequestTraining = alexw@caltech.edu | ||
|EmailList = kni-XeF2 | |EmailList = kni-XeF2 | ||
|EmailListName = | |EmailListName = XeF<sub>2</sub> | ||
}} | }} | ||
== Description == | == Description == | ||
The XeF<sub>2</sub> etcher flows pressure and time controlled pulses of XeF<sub>2</sub> gas into a chamber to deliver an isotropic etch | The XeF<sub>2</sub> etcher flows pressure- and time-controlled pulses of XeF<sub>2</sub> gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices. | ||
===== Applications ===== | ===== Applications ===== | ||
| Line 25: | Line 25: | ||
== Resources == | == Resources == | ||
===== Equipment Status ===== | |||
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select XeF2 from the dropdown menu) | |||
===== SOPs ===== | ===== SOPs ===== | ||
* [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP] | * [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP] | ||
Revision as of 05:33, 30 June 2022
|
Description
The XeF2 etcher flows pressure- and time-controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices.
Applications
- Very high selectivity dry Si etching
- MEMS fabrication
Resources
Equipment Status
- LabRunr Equipment Status (Select XeF2 from the dropdown menu)