Difference between revisions of "DWL-66: Direct-Write Laser System"

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Line 7: Line 7:
|RoomLocation = B217 Steele
|RoomLocation = B217 Steele
|LabPhone = 626-395-1536
|LabPhone = 626-395-1536
|PrimaryStaff = [[Bert Mendoza]]
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = bertm@caltech.edu
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-4075
|StaffPhone = 626-395-3371
|Manufacturer = Heidelberg Instruments
|Manufacturer = Heidelberg Instruments
|Model = DWL-66
|Model = DWL-66

Revision as of 18:39, 27 August 2020

DWL-66 Direct-Write Laser System
Instrument Type Lithography
Techniques Direct Patterning,
Pattern Alignment,
Wafer and Mask Patterning
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for DWL66 email list
Lab Location B217 Steele
Lab Phone 626-395-1536
Manufacturer Heidelberg Instruments
Model DWL-66


The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.

  • Direct Writing
  • Grayscale Writing


Equipment Data
Optical Lithography Resources
Manufacturer Manuals


  • Exposure: 442 nm wavelength HeCd laser