EBPG 5000+: 100 kV Electron Beam Lithography
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Description
The Raith EBPG 5000+ is a dedicated direct-write Electron Beam Pattern Generator that is used to pattern large areas by high-resolution electron beam lithography. This instrument has substrate holders to handle 2, 4, and 6" wafers, piece parts from a couple of mm to 6" diameter, and 3" and 5" mask plates. While this instrument can be set to operate at 20, 50, or 100 keV, it is normally set for 100 keV operation (i.e. with an accelerating voltage of 100 kV, the average energy per electron is 100 keV).
Operational Applications
- Non-aligned electron beam lithography
- Aligned (aka direct-write) electron beam lithography
Scientific / Technical Applications
- Nanophotonics
- Nano-optics
- Waveguides
Resources
General SOPs
- EBPG SOP
- User's Guide to the EBPG pg computer desktop
- EBPG Troubleshooting Guide
- EBPG reservation and use policy
- EBPG Training presentation (Caltech-only access)
- EBPG Pre-exposure Walkthrough procedure (video)
Sample Prep and Writing SOPs
- EBPG Preparing pieces for exposure on 5000+ SOP
- EBPG High Resolution Mode SOP
- EBPG Preparing sample for exposure SOP
- EBPG Beam Adjustment SOP
- EBPG Marker definition Procedure
- EBPG Adjust Aperture SOP
- EBPG JOY Marker Procedure
- EBPG Disable marker height check SOP
- EBPG Holderfix SOP
- EBPG Remote Access SOP (log into LabRunr and download SOP from EBPG 5000+ page)
Troubleshooting SOPs
- Information Archive Beam
- BEAMS $pg shutdown / coldstart SOP
- Beam file Recovery SOP
- Lindgren MACS SOP
- EBPG Emergency air cylinder SOP
- EBPG Unlocking the stage SOP
- EBPG SAEHT not initialized SOP
- EBPG SAEHT no route to host recovery SOP
- EBPG hotbox slave communications fault recovery SOP
- EBPG FEG recovery and new beam table SOP
- Raith Common errors and solutions with aligned writing SOP
- EBPG 5000+ Troubleshooting Loader errors
Data Preparation Resources
- SOP: KNI Introduction to Layout BEAMER
- App Note: 3D Surface Proximity Effect Correction
- App Note: Fracture Optimization
- App Note: Writing Time Optimization
- App Note: Formulas in Beamer Modules
- App Note: Multipass
- App Note: Mixed Export Options
- App Note: GPF Formatter
Lithography Process Information
- Bi-Layer PMMA Resist Spinning Recipe
- MAN Resist Data Sheet
- PMMA Resist Data Sheet
- SML Resist Data Sheet
- ZEP Resist Data Sheet
- ZEP 520A Resist: Procedure for spinning, writing & development (Caltech-only access)
- HSQ Resist: Procedure for spinning, writing & development (Caltech-only access)
- Supramolecular Resist processing (Caltech-only access)
- Laurell Spinner cleaning SOP
Manufacturer Manuals
- Raith cjob manual (Caltech-only access)
- Layout Beamer Release Notes
- Layout Beamer Manual
- Laurell Spin Coater Manual (log into LabRunr and download Manual from EBPG 5000+ page)
Specifications
Manufacturer Specifications and Manuals
Specifications
- Voltage Range: 20, 50 or 100 kV
- Current Range: 50 pA to 200 nA
- Main Field Size: Up to 1 mm x 1 mm
- Main Field Resolution: 20 bit
- Maximum Writing Frequency: 100 MHz
- Aperture Sizes: 300μm, 300μm, 400μm
Related Instrumentation in the KNI
Electron Beam Lithography
- EBPG 5200: 100 kV Electron Beam Lithography
- EBPG 5000+: 100 kV Electron Beam Lithography
- Quanta 200F: SEM with 1-30 kV Electron Beam Lithography
- Tecnai TF-20: TEM & STEM with 80-200 kV Electron Beam Lithography