XeF2 Etcher for Silicon

XeF2 Silicon Etcher Instrument Type Etching Techniques Selective dry Si etching Staff Manager Alex Wertheim Staff Email alexw@caltech.edu Staff Phone 626-395-3371 Reserve time on FBS Request training via FBS User Dashboard Lab Location B235C Steele Lab Phone 626-395-1539 Manufacturer N/A Model N/A

Description

The XeF₂ etcher flows pressure- and time-controlled pulses of XeF₂ gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices.

Applications

• Very high selectivity dry Si etching
• MEMS fabrication

Resources

SOPs

• KNI SOP