Tube Furnaces for Wet & Dry Processing: Difference between revisions
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(added sapphire samples allowed) |
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* Water Vapor (Tube 1) | * Water Vapor (Tube 1) | ||
== Resources == | == Resources == | ||
===== Equipment | ===== Equipment Status ===== | ||
* [https://caltech. | * [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Furnace1 or Furnace2 from the dropdown menu) | ||
===== Tystar Oxidation Recipe ===== | ===== Tystar Oxidation Recipe ===== | ||
* [https://caltech.box.com/s/nqiiqwlhip4dcult2mtuvvdlxw0gv086 Wet Oxidation 1000C ] | * [https://caltech.box.com/s/nqiiqwlhip4dcult2mtuvvdlxw0gv086 Wet Oxidation 1000C ] | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://caltech.box.com/s/yrvj5tar3r2e2ldq9orm2bh5mlkavw05 KNI SOP ] | * [https://caltech.box.com/s/yrvj5tar3r2e2ldq9orm2bh5mlkavw05 KNI SOP ] | ||
Revision as of 05:38, 30 June 2022
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Description
The system is designed for processing up to one-hundred, 150 mm (6") silicon or sapphire wafers per tube and can accommodate smaller sample sizes also. Tube 1 is designated for wet & dry oxidation using a flask evaporator. Tube 2 is designated for dry oxidation and annealing.
Applications
- Dry & Wet oxidation
- Annealing
Allowed Materials
- Silicon or sapphire that is completely free of metal or organic contamination
- Recommended to have undergone a standard RCA clean or similar beforehand
- No other sample material allowed
- No metal or organic contamination
- Wafers must not have been contacted by metal tweezers, etc. without appropriate cleaning to remove metal contamination
Gas List
- Nitrogen
- Oxygen
- Water Vapor (Tube 1)
Resources
Equipment Status
- LabRunr Equipment Status (Select Furnace1 or Furnace2 from the dropdown menu)