DWL-66: Direct-Write Laser System: Difference between revisions
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|RoomLocation = B217 Steele | |RoomLocation = B217 Steele | ||
|LabPhone = 626-395-1536 | |LabPhone = 626-395-1536 | ||
|PrimaryStaff = [[ | |PrimaryStaff = [[Alex Wertheim]] | ||
|StaffEmail = | |StaffEmail = alexw@caltech.edu | ||
|StaffPhone = 626-395- | |StaffPhone = 626-395-3371 | ||
|Manufacturer = Heidelberg Instruments | |Manufacturer = Heidelberg Instruments | ||
|Model = DWL-66 | |Model = DWL-66 |
Revision as of 18:39, 27 August 2020
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Description
The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.
Applications
- Direct Writing
- Grayscale Writing
Resources
Equipment Data
SOPs
Optical Lithography Resources
Manufacturer Manuals
Specifications
- Exposure: 442 nm wavelength HeCd laser