MLA-150 Maskless Aligner

MLA-150 Maskless Aligner File:*needs image* Instrument Type Lithography Techniques Frontside Alignment, Backside Alignment, Maskless lithography Staff Manager Alex Wertheim Staff Email alexw@caltech.edu Staff Phone 626-395-3371 Reserve time on FBS Request training via FBS User Dashboard Lab Location B217 Steele Lab Phone 626-395-1535 Manufacturer Heidelberg Model MLA-150

Description

The maskless aligner is a tool that enables fast iteration on layout designs by enabling patterns to be exposed without the need for a photomask. In addition, can be used to fabricate photomasks for use with mask aligners such as the Suss MA6 mask aligners. Compatible with broadband photoresists. Can achieve a minimum feature size of 450 nm. Accepts wafers and mask plates up to 200 mm.

Maskless Aligner Applications

• Maskless photolithography
• Photomask fabrication

Resources

Manufacturer Specifications

• 375 nm laser compatible with broadband photoresists.
• Supports both high quality (450 nm minimum feature) and fast write modes (1 um minimum features).
• Wafers and mask plates up to 200 mm supported.
• Minimum chip size acceptable: 10 mm.
• Automatic global and field alignment capability.
• Optical and pneumatic autofocusing.

SOPs & Troubleshooting

• [*placeholder link* General SOP & Troubleshooting]

Manufacturer Manuals

• [*placeholder link* Heidelberg MLA150 Operator Manual]

FBS Reservation Rules:

	Advanced Res (days)	Limit per Res (hrs)	Limit per week (hrs)
Weekday	7	4	12
Weeknight	7	6	18
Weekend	14	6	18

For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.

Optical Lithography Resources

• Optical Lithography Resources Page
• Laurell Spinner Cleaning SOP
• Laurell Spinner - Spinning Resist Video

Process Recipes

• Optical Lithography Photoresist Recipes

Related Instrumentation in the KNI

Optical Lithography

• i-Line Wafer Stepper: GCA model 6300
• Contact Mask Aligners: MA6 & MA6/BA6
• Nano Imprint Lithography: NILT CNI-PV 2.1
• Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
• Optical Lithography Resources

Electron Beam Lithography

• EBPG 5200: 100 kV Electron Beam Lithography
• EBPG 5000+: 100 kV Electron Beam Lithography
• Quanta 200F: SEM with 1-30 kV Electron Beam Lithography

Ion Beam Lithography

• ORION NanoFab: Helium (5-40 kV), Neon (5-35 kV) & Gallium (1-30 kV) Focused Ion Beam Lithography & Microscopy