Difference between revisions of "XeF2 Etcher for Silicon"

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== Description ==
== Description ==
The XeF2 etcher flows pressure and time controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch which is highly selective only to Silicon. It is commonly used to remove Si under layers accessed through Vias to suspend membranes and other structures in MEMS devices.  
The XeF<sub>2</sub> etcher flows pressure and time controlled pulses of XeF<sub>2</sub> gas into a chamber to deliver an isotropic etch which is highly selective only to Silicon. It is commonly used to remove Si under layers accessed through Vias to suspend membranes and other structures in MEMS devices.  


===== Applications =====
===== Applications =====
* Very high selectivity dry Si etching
* Very high selectivity dry Si etching
* MEMS fabrication  
* MEMS fabrication


== Resources ==
== Resources ==
===== SOPs =====
===== SOPs =====
* [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP]
* [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP]

Revision as of 00:54, 21 May 2019

XeF2 Silicon Etcher
XeF2-Etcher.jpg
Instrument Type Etching
Techniques Selective dry Si etching
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for XeF2 email list
Lab Location
Lab Phone 626-395-1539
Manufacturer N/A
Model N/A

Description

The XeF2 etcher flows pressure and time controlled pulses of XeF2 gas into a chamber to deliver an isotropic etch which is highly selective only to Silicon. It is commonly used to remove Si under layers accessed through Vias to suspend membranes and other structures in MEMS devices.

Applications
  • Very high selectivity dry Si etching
  • MEMS fabrication

Resources

SOPs