| Suss Microtec SB6L Wafer Bonder
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| Lab Location
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| Lab Phone
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626-395-1539
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| Manufacturer
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Suss Microtec
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| Model
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SBL6
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics fabrication
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
