Difference between revisions of "Wafer Bonder"

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== Resources ==
== Resources ==
===== SOPs & Troubleshooting =====
===== SOPs =====
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 General SOP & Troubleshooting]
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SOP]

===== Manufacturer Manuals =====
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]
== Specifications ==
===== Notable Specifications =====

Latest revision as of 22:06, 28 May 2019

Wafer Bonder
Wafer-Bonder Suss-SB6L.jpg
Instrument Type Support Tools,
Substrate Processing
Techniques Pressure/Heat Bonding
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Wafer Bonder email list
Lab Location B217 Steele
Lab Phone 626-395-1539
Manufacturer Suss Microtec
Model SBL6


The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.

  • MEMS & Microelectronics Fabrication


Manufacturer Manuals